Solarworld Innovations Gmbh

Deutsche Cell Gmbh

Solarworld Industries Gmbh

Holger Neuhaus

Andreas Krause

Martin Kutzer

Bernd Bitnar

Olaf Storbeck

Harald Hahn

Matthias Georgi

Frederick Bamberg

Thomas Seidel

Kristian Schlegel

Reinhold Schlosser

Matthias Schaarschmidt

Thilo Richter

Alexander Fülle

Claudia Lengsfeld

Wolfgang Enger

Paul Grunow

Michael Heemeier

In various embodiments, a photovoltaic module may include: a plurality of photovoltaic cells, at least one photovoltaic cell of the number of photovoltaic cells comprising: a first plurality of contact wires on a front of the photovoltaic cell; and a second plurality of contact wires on a rear of the photovoltaic cell. The first plurality of contact wires and the second plurality of contact wires may be arranged offset with respect to one another.

Photovoltaic module, method for electrically connecting a plurality of photovoltaic cells, and device for electrically connecting a plurality of photovoltaic cells

A method for contacting and connecting solar cells, according to which at least one electrode is formed by at least one wire conductor, and including the following steps:

Method for contacting and connecting solar cells

An electrode for electrically connecting two photovoltaic cells is provided. Each photovoltaic cell may include a plurality of lamellar electrically conductive surface regions. The electrode may include a plurality of electrically conductive wires extending adjacent to one other; and a stabilizing structure coupled to the plurality of electrically conductive wires such that the space between the electrically conductive wires to one another is defined until the plurality of electrically conductive wires has been fixed on the plurality of lamellar electrically conductive surface regions of a photovoltaic cell.

Photovoltaic cell electrode and method for electrically connecting a photovoltaic cell

The invention relates to a method for masking a semiconductor substrate including the following steps: providing a planar semiconductor substrate having a first side and a second side lying opposite thereto, applying a mask to at least one of the sides, an extrusion printing method being used for applying the mask.

Masking method

A method for the production of a contact structure of a semiconductor component comprises the masking of at least one side of a semiconductor substrate with a coating and the partial removal thereof in at least one pre-determined region.

Method for producing a contact structure of a semiconductor component

A semiconductor component, especially a solar cell comprises a semiconductor substrate of a planar design having a first side and a second side lying opposite thereto, at least one contact structure arranged on at least one side of the semiconductor substrate, the at least one contact structure exhibiting a diffusion barrier to prevent the diffusion of ions from the contact structure into the semiconductor substrate.

Semiconductor component with contacts made of alloyed-in metal wires

A semiconductor component, in particular in the form of a solar cell, comprises a two-dimensional semiconductor substrate with a first side, a second side which is arranged opposite thereto, a surface normal which is perpendicular to said first and second sides, and a plurality of recesses which are at least arranged on the second side and extend in the direction of the surface normal, at least one dielectric passivation layer which is arranged on the second side, an electrically conducting contact layer arranged on the passivation layer, a plurality of contact elements for electrically connecting the contact layer with the semiconductor substrate, which contact elements are electrically conductive, are in electrically conducting connection with both the semiconductor substrate and with the contact layer, fill at least 50%, in particular at least 90%, preferably 100% of in each case one of the recesses, project beyond the recesses with a projection in the direction perpendicular to the surface normal and are of an easily solderable material.

Semiconductor component

A method for the production of a contact structure of a solar cell allows p-contacts and n-contacts to be produced simultaneously.

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Freiberg, Germany

Holger Neuhaus