Robert Boschgmbh

Holger Hoefer

Jochen Reinmuth

Michael Knauss

Stefan Pinter

Burkhard Kuhlmann

Ricardo Ehrenpfordt

Michael Stumber

Frank Reichenbach

Udo Bischof

Florian Grabmaier

Frederik Ante

Klaus Offterdinger

Lutz Mueller

Eckart Schellkes

Eric Ochs

Axel Grosse

Daniel Haug

Ralf Hausner

Daniel Pantel

Volker Schmitz

Uwe Hansen

Sebastian Schuler-Watkins

Christian Solf

Lutz Rauscher

Maximilian Amberger

Anja Neubert

A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

Method for producing a micromechanical device having a damper structure

A sensor and/or sound detection device having a sensing device having a sensitive surface, an access channel being designed in such a way that air and/or a gas is transferable through the open access channel between a spatial surroundings of the sensor/detection device and the sensitive surface, and an at least partially water-impermeable membrane having respectively an inner side of the membrane facing the associated access channel being designed in such a way that a contact surface on the respective inner side of the respective membrane is pressed against an associated membrane contact surface on the associated access channel in such a way that the associated access channel is sealed in a liquid-tight manner when an outer side of the respective membrane or a covering layer on the respective outer side of the membrane is wetted with at least a minimum quantity of liquid and the respective membrane is deformed.

Sensor and/or sound detection device and manufacturing method for a sensor and/or sound detection device

A method for producing thin MEMS chips on SOI substrate including: providing an SOI substrate having a silicon layer on a front side and having an oxide intermediate layer, producing a layer structure on the front side of the SOI substrate and producing a MEMS structure from this layer structure, capping the MEMS structure and producing a cavity, and etching a back side of the SOI substrate down to the oxide intermediate layer. Also described is a micromechanical component having a substrate, a MEMS layer structure having a MEMS structure in a cavity and a cap element, the MEMS structure and its cavity being enclosed by the substrate underneath and the cap element above, the substrate being made of polycrystalline silicon.

Method for producing thin MEMS chips on SOI substrate and micromechanical component

A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.

Damping device for a micromechanical sensor device

An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

Solder joint inspection

A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

Sensor system

An integrated component having a substrate, the substrate having a cavity which surrounds a mechanical structure. The cavity is filled by a fluid of a specific composition under a specific pressure, and the mechanical properties of the mechanical structure are influenced by the fluid.

Method for sealing an opening

The invention relates to a microstructured sensor, having at least one measurement chip in which there is formed a first measurement area having a first measurement structure and a second measurement area having a second measurement structure, the measurement areas being offset to one another in a lateral direction, one cap chip that is fastened in vacuum-tight fashion to the measurement chip in a connecting area, one intermediate space, formed between the measurement chip and the cap chip, that is sealed outwardly by the connecting area and in which the measurement areas are situated, and at least one contact area, formed on the measurement chip, and left exposed by the cap chip, for the contacting of the measurement chip. The sensor can be in particular a gas sensor for measuring a gas concentration, or an acceleration sensor.

Microstructured sensor

A ceramic substrate having a defined curvature and a method of its manufacture are described. For this purpose at least two ceramic layers having different defined temperature coefficients of expansion are positioned on top of one another and are permanently bonded together. A curved ceramic substrate may be advantageously utilized in micro-hybrid technology, in multilayer ceramic technology, or in hybrid technology, e.g., as a membrane element of a piezoresistive pressure sensor element.

Ceramic substrate and method of manufacturing same

A method for processing substrates, in which a photoresist layer is applied and structured on their surface. By blasting the substrate with particles, recesses are put into the surface of the substrate in those areas not covered by photoresist.

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Sonnenbuehl, Germany

Holger Hoefer