Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Holger Bera

Heiko Brunner

Andreas Walter

Christof Suchentrunk

Gerhard Steinberger

Sven Rückbrod

Thomas Beck

Bernd Froese

Boris Alexander Janssen

Britta Schafsteller

Carsten Krause

Iulia Bejan

Jan Picalek

Christian Schwarz

Shakeel Akhtar

Jennifer Pinnau

Sebastian Weissbrod

Sven Ruckbrod

Schulze Andreas

Sven RÜCKBROD

The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and an unsaturated compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the unsaturated compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The unsaturated compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.

Plating bath composition and method for electroless plating of palladium

The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilizing agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.

Plating bath for electroless deposition of nickel layers

The present invention relates to aqueous, alkaline plating bath compositions for electroless deposition of ternary and quaternary cobalt alloys Co-M-P, Co-M-B and Co-M-B&#x2014;P, wherein M is selected from the group consisting of Mn, Zr, Re, Mo, Ta and W which comprise a propargyl derivative as the stabilizing agent. The cobalt alloy layers derived there from are useful as barrier layers and cap layers in electronic devices such as semiconducting devices, printed circuit boards, and IC substrates.

Alkaline plating bath for electroless deposition of cobalt alloys

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Berlin, Germany

Holger Bera