Danfoss Silicon Power Gmbh

Holger Beer

Lars Paulsen

Klaus Kristen Olesen

Ole Mühlfeld

Henning Ströbel-Maier

Georg Wecker

Christopher Klaehr

The invention relates to an electronic power system () comprising at least one electronic power module (). The electronic power module () comprises a base plate () and at least one heat generating component arranged on a first side of the base plate (). The electronic power module () comprises a cooling structure () transporting heat away from the electronic power module () via a coolant that is guided by the cooling structure (). The cooling structure () is arranged on a second side () of the base plate () opposite to the first side. Task of the invention is to provide an electronic power system () with an improved cooling. According to the present invention this task is solved in that the cooling structure () is integrally formed with the base plate ().

Electronic power system and method for manufacturing the same

A lead frame is provided, including one or more power terminals and one or more control terminals, wherein at least one of the control terminals is externally terminated with a press-fit contact member, and wherein at least one of the control terminals and at least one power terminals are formed from different materials. With the disclosed lead frame of the invention, lower material cross sections in the power terminals will be provided because of the better electrical conductivity when using pure copper compared to alloys with higher mechanical strengths. Also specific/different plating could be added to the individual needs of the different pin types without using masks in the plating process.

Lead frame and method of fabricating the same

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Flensburg, Germany

Holger Beer