Heraeus Deutschland Gmbh & Co Kg

O-flexx Technologies Gmbh

Heraeus Electronics Gmbh & Co. Kg

Heraeus Precious Metals Gmbh & Co. Kg

Holger Albert Ulland

Richard Walter

Robert Sievi

Susanne Behl

Michael Gock

Holger Rauter

Christian Neumann

Kai-Ulrich Boldt

Michael Bisges

Alan Paul Stadnik

Peter Krämer

Muriel Thomas

Platinum complex of the type [L1L2Pt[O(CO)R1]X], wherein L1 and L2 are the same or different monoolefin ligands or together represent a compound L1L2 acting as a diolefin ligand, wherein X is selected from bromide, chloride, iodide, and —O(CO)R2, wherein —O(CO)R1 and —O(CO)R2 are the same or different C6-C18 or C8-C18 non-aromatic monocarboxylic acid groups with the exception of a phenylacetic acid group, or together represent a C8-C18 non-aromatic dicarboxylic acid group —O(CO)R1R2(CO)O—, wherein it is a mononuclear platinum complex where n=1, or wherein, in the event of the presence of L1L2 and/or of —O(CO)R1R2(CO)O—, it may be a polynuclear platinum complex with a whole number n>1.

Platinum complexes

A method of manufacturing a semiconductor package which is at least in part covered by an electromagnetic interference shielding layer. The method includes at least these steps: i. providing the semiconductor package and an ink composition having at least a compound comprising at least one metal precursor and at least one organic compound; ii. applying at least a part of the ink composition onto the semiconductor package, wherein a precursor layer is formed; and iii. treating the precursor layer with an irradiation of a peak wavelength in the range from 100 nm to 1 mm. Further disclosed is a semiconductor package comprising an electromagnetic interference shielding layer comprising at least one metal, wherein the semiconductor package is obtainable by the aforementioned method. Still further disclosed are a semiconductor package comprising an electromagnetic interference shielding layer having a specific conductance and thickness, and uses of an ink composition.

Method of manufacturing an electromagnetic interference shielding layer

An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.

Electromagnetic interference shielding in recesses of electronic modules

Preparations of platinum complexes

A heat exchanger for at least one thermoelectric thin film element, having a hot and a cold side arranged on opposite longitudinal sides of the thin film element. The hot side is connected to a coupling element on a warm source and the cold side is connected to a heat sink. The heat exchanger connects in a simple and active manner to the thermoelectric thin film element and improves the efficiency of the attached thermoelectric thin film element. Especially flexible thin film elements spread out between the coupling element and the heat sink of the heat exchanger and support the load between the coupling element and the heat sink by a thermally insulating support structure.

Heat exchange for a thermoelectric thin film element

Growing community of inventors

Willich, Germany

Holger Albert Ulland