Hitachi Chemical Company, Ltd.

Hoko Kanazawa

Masami Yusa

Tohru Fujinawa

Satoyuki Nomura

Hiroshi Ono

Itsuo Watanabe

Motohiro Arifuku

There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure

Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure

The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

Wiring-connecting material and wiring-connected board production process using the same

Wiring-connecting material and process for producing circuit board with the same

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Tsukuba, Japan

Hoko Kanazawa