Samsung Electronics Co., Ltd.

Hojun Chang

Jaewoo Lee

Hundae Choi

Jeongdon Ihm

Garam Choi

Yonghun Kim

Jinseok Heo

Kihan Kim

Yoo-Chang Sung

A semiconductor chip includes a write clock buffer, a voltage regulator, a process calibration circuit and a temperature calibration circuit. The voltage regulator generates plural regulated voltages. The process calibration circuit output one of the regulated voltages as a bias voltage of the write clock buffer, depending on a process variation of the semiconductor chip. The temperature calibration circuit track a temperature variation of the semiconductor chip in real time, performs analog calibration on the bias voltage from the process calibration circuit in real time depending on a result of the tracking, and outputs the analog-calibrated bias voltage to the write clock buffer.

Semiconductor chip capable of calibrating bias voltage supplied to write clock buffer regardless of process variation and temperature variation, and devices including the same

Disclosed is a frequency divider which includes a frequency dividing core circuit that includes a plurality of transistors and is configured to generate at least one division clock signal based on a clock signal and an inverted clock signal, a controller that is configured to generate a body bias control signal based on clock frequency information, and an adaptive body bias (ABB) generator that is configured to generate at least one body bias based on the body bias control signal and configured to apply the at least one body bias to a body of one or more of the plurality of transistors.

Frequency divider and memory device including the same

A semiconductor memory device includes a mode register set and a clock correction circuit. The mode register set stores a first control code set. During a duty training interval based on a duty training command, the clock correction circuit may divide the duty training interval into a first interval, a second interval and a third interval which are consecutive, may correct a phase skew of a first clock signal and a third clock signal during the first interval, may correct a phase skew of a second clock signal and a fourth clock signal during the second interval, and may correct a phase skew of the first clock signal and the fourth clock signal during the third interval. The semiconductor memory device may enhance signal integrity of clock signals by correcting duty errors and phase skews of the clock signals having multi-phases during the duty training interval.

Semiconductor memory device and memory system including the same

A method of operating a memory device includes receiving a duty training request, performing first training for a write path in a first period, storing a result value of the first training, performing second training for a write path in a second period, storing a result value of the second training, transmitting the result value of the first training to an external device, and receiving a duty cycle adjuster (DCA) code value corresponding to the first training result value from the external device.

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Seoul, South Korea

Hojun Chang