Apple Inc.

Hoishun Li

James A Yurko

Abhijeet Misra

Brian M Gable

Michael Benjamin Wittenberg

Lee E Hooton

James A Curran

Zechariah D Feinberg

Herng-Jeng Jou

Lei Gao

Fletcher R Rothkopf

Mattia Pascolini

Christopher D Prest

Eric Steven Jol

Colin M Ely

Erik G De Jong

Theodore Andrew Waniuk

Jayesh Nath

Jason C Sauers

Daniel C Wagman

Carlo Di Nallo

James A Wright

Ehsan Khajeh

Richard Hung Dinh

Mario Martinis

Rex Tyler Ehman

Alexander W Williams

William A Counts

Hani Esmaeili

Zheyu Wang

Daniel J Hiemstra

Todd S Mintz

George Ho Yin Mak

Isabel Yang

Eric W Hamann

Yu Yan

Wai Man Raymund Kwok

Weiming Huang

Henry B Wettersten

Craig A Horton

Anthony D Prescenzi

Michael P Coleman

Nathaniel A Dixon

Jennifer D Schuler

Andrew W Meschke

Chuan Liu

Ethan E Currens

A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.

Additively manufactured device enclosures

Improving the accuracy of ultrasonic touch sensing and fingerprint imaging using acoustic impedance matching is disclosed. Acoustic impedance mismatches between an ultrasonic transducer array and a sensing plate can be reduced to maximize energy transfer and minimize parasitic reflections. A reduction in acoustic impedance mismatches can be accomplished using (i) a composite epoxy having a higher acoustic impedance than epoxy alone, (ii) one or more matching layers having an acoustic impedance that is approximately the geometric mean of the acoustic impedance of the sensing plate and the acoustic impedance of the transducer array, (iii) pores or perforations in the sensing plate, or (iv) geometric structures formed in the sensing plate. In addition, parasitic reflections can be suppressed using an absorbent layer.

Geometric structures for acoustic impedance matching and improved touch sensing and fingerprint imaging

A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

Electronic device including clad components

A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

Core shell with various filler materials for enhanced thermal conductivity

A method of forming a unitary sintered body can include cutting a first portion and a second portion from a sheet of feedstock. The feedstock can include ceramic or metallic particles suspended in a binder. The first portion can be positioned in contact with the second portion and the portions can be sintered together to form the unitary body.

Additive manufacturing methods for components

A component for an electronic device can include a metal injection molded (MIM) metallic body that at least partially defines an exterior surface. The metallic body can have an average porosity less than 1% in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average porosity greater than 1% in a second region adjacent to the first region.

Surface treatment for metallic components

A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.

Nanotwin copper components

This application relates to a portable electronic device. The portable electronic device includes an enclosure having a metal oxide coating, the metal oxide coating including a metal alloy substrate that is doped with a dopant, and a metal oxide layer overlaying and formed from the metal alloy substrate so that the metal oxide layer includes the dopant.

Doped metal oxide coating having increased color durability

This application relates to an enclosure for a portable electronic device. The enclosure includes a metal substrate and a dehydrated anodized layer overlaying the metal substrate. The dehydrated anodized layer includes pores having openings that extend from an external surface of the dehydrated anodized layer and towards the metal substrate, and a metal oxide material that plugs the openings of the pores, where a concentration of the metal oxide material is between about 3 wt % to about 10 wt %.

Plugging anodic oxides for increased corrosion resistance

The disclosure provides methods of making iron-based alloys, as well as resulting alloys. An iron-based alloy containing a small amount of nickel (e.g., 0.5 to 2.0 wt %) is annealed and machined. The alloy is sufficiently ductile to reduce the likelihood of cracking, while not sufficiently high to result in a hardened alloy. After the alloy is shaped, the alloy is hardened by nitriding.

Steel compositions and solution nitriding of stainless steel thereof

A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

Coupling structures for electronic device housings

Growing community of inventors

San Jose, CA, United States of America

Hoishun Li