Asm Assembly Automation Limited

Hoi Shuen Joseph Tang

Chi Wah Cheng

Tim Wai Tony Mak

Chi Hang Leung

Ping Chun Benson Chong

See Lok Chan

Kai Chiu Adam Wu

Ka On Alfred Yue

An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.

Apparatus and method for arranging devices for processing

An apparatus and method are provided for aligning a plurality of semiconductor devices placed on a carrier. Alignment guides are located adjacent to each device in use, and arranged such that they correspond to a desired alignment of each semiconductor device. For alignment, the semiconductor devices are held by a positioning device comprising a plurality of holders, each holder being configured to generate a force to hold a semiconductor device. Actuators are also provided that are operative to move the positioning device and holders to bias the semiconductor devices against the alignment guides to orientate the semiconductor devices until they are aligned with said alignment guides.

Apparatus and method for aligning devices on carriers

A solder reflow oven for the processing of ball grid array substrates bearing solder balls is described, comprising: input means for introducing substrates into the oven, a processing chamber within which the substrates are subject to a solder reflow process, and output means for discharging substrates from the oven for further processing or handling, and means for transferring the substrates through the processing chamber in a first direction towards the output means. The processing chamber comprises a plurality of heating and cooling zones arranged with a constant pitch in the first direction, and the transferring means is adapted to move the substrates in the first direction in stages, with each component moving a distance equal to the pitch between two zones in each stage, whereby the components are moved from zone to zone in stages. In addition each block of each heating zone and each block of each cooling zone is connected to a source of fresh gas, and each block of each heating zone is provided with means for heating the gas, and each block of each cooling zone is provided with means for cooling the gas, and each block is formed with a serpentine channel between the source of fresh gas and at least one opening through which the gas is discharged from the block towards a substrate.

Solder reflow oven

Growing community of inventors

Hong Kong, China

Hoi Shuen Joseph Tang