Picojet, Inc.

Le, Thanh P.

Nextjet, LLC

Le, Hoi P.

Le, Hue P.

Tran, Linh B.

Hoi P Le

Hue Phuoc Le

Thanh P Le

Linh B Tran

Hue P Le

A piezoelectric ceramic ink-jet print head is made by an inventive ultrasonic bonding process. Specifically, there are several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern, and improved print head-piezoelectric electrical contacts. Further, there is an ultrasonic bonding process joining metallic objects with ultrasonic energy.

Ultrasonic bonding process for making a microfluid device

There is disclosed a piezoelectric ceramic ink-jet print head and made by an inventive ultrasonic bonding process. Specifically, there are disclosed several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern, and improved print head-piezoelectric electrical contacts. Further, there is disclosed an ultrasonic bonding process joining metallic objects with ultrasonic energy.

Microfluid device and ultrasonic bonding process

A piezoelectric ceramic ink-jet print head is made by ultrasonic bonding processes. Several improved features of ink jet print heads include more cost-effective bonding processes using an ultrasonic bonding technique, an improved piezoelectric ceramic structural element pattern, and improved print head piezoelectric electrical contacts. There is also disclosed an ultrasonic bonding process for joining ceramic and metallic objects.

Ultrasonic bonding of ink-jet print head components

There is disclosed a piezoelectric ceramic ink-jet print head and made by an inventive ultrasonic bonding process. Specifically, there are disclosed several improved features of inkjet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern and improved print head-piezoelectric electrical contacts. Further, there is disclosed an ultrasonic bonding process joining metallic objects with ultrasonic energy.

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Beaverton, OR, United States of America

Hoi P Le