Hong Kong Baptist University

Other

Hkbu R&d Licensing Limited

Cathay Photonics Limited

Hoi Lam Tam

Kok Wai Cheah

Wing Yui Lam

Yu Wai Chan

King Fai Li

Wai Kwok Wong

Ka Suen Lee

Guixin Li

Suet Ying Ching

Gui Xin Li

Shing Chi Tse

A method for forming a substrate with a multi-layered, flexible, and anti-scratch metal oxides protective coating being deposited onto the substrate is provided in the present invention, wherein the top most layer of the coating comprises AlOor a mixture thereof such that the top most layer acts as an anti-scratching layer. The multi-layered, flexible and anti-scratch metal oxides protective coating also retains the flexibility of the underlying substrate.

Sapphire coated substrate with a flexible, anti-scratch and multi-layer coating

A method to transfer a layer of harder thin film substrate onto a softer, flexible substrate. In particular, the present invention provides a method to deposit a layer of sapphire thin film on to a softer and flexible substrate e.g. quartz, fused silica, silicon, glass, toughened glass, PET, polymers, plastics, paper and fabrics. This combination provides the hardness of sapphire thin film to softer flexible substrates.

Sapphire thin film coated substrate

A method to transfer a layer of harder thin film substrate onto a softer, flexible substrate. In particular, the present invention provides a method to deposit a layer of sapphire thin film on to a softer and flexible substrate e.g. PET, polymers, plastics, paper and fabrics. This combination provides the hardness of sapphire thin film to softer flexible substrates.

Sapphire thin film coated flexible substrate

A method to deposit a layer of harder thin film substrate onto a softer substrate. In particular, the present invention provides a method to deposit a layer of sapphire thin film on to a softer substrate e.g. quartz, fused silica, silicon and (toughen) glass. This combination is better than pure sapphire substrate.

A light emitting diode (LED), and a method for producing the same. The LED includes a substrate that may be made of silicon, a first conductive layer on one side, and a porous insulating layer on the opposite side. The insulating layer defines microcavities therein, the microcavities having sharp tips on their inner surfaces. The microcavities have gas inside. A second conductive layer is disposed over the insulating layer. When an electrical potential is applied between the conductive layers, the gas-filled microcavities act as plasma discharge lamps, emitting light. The light may be in the ultraviolet portion of the spectrum. The method includes etching a substrate to produce a porous insulating layer on one side, depositing a first conductive layer on the opposite side, and depositing a second conductive layer over the insulating layer. The microcavities in the insulating layer are then filled with gas.

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Hong Kong, China

Hoi Lam Tam