General Semiconductor, Inc.

General Instrument Corporation of Delaware

Kras Asia Ltd.

Hohn Jong Hsiung

Eugene Chen

Kuang Hann Lin

Boon Meng Chan

Wing Lun Wong

In a method of injection molding elements, a first step is to charge a molding compound into an injection nozzle via a side hole defined in the nozzle under the control of a mini-plunger which is selectively reciprocally movable within a bore of the injection nozzle. In a second step, the mini-plunger is reciprocally moved in the bore of the nozzle for injecting substantially the entire molding compound in the bore of the injection nozzle into at least one cavity of a mold via a separate gate passage defined in the mold. Each gate passage is a narrow capillary aperture that connects the bore of the injection nozzle with a different one of the at least one cavity of the mold. In a third step, the nozzle and the mold are separated after the molding compound in the gate passage is cured but before the molding compound in the at least one cavity of the mold is cured. In a fourth step the molded element is removed from the at least one cavity of the mold once the molding compound therein is cured.

Method of injection molding elements such as semiconductor elements

An injection molding apparatus includes a nozzle which is directly connected to a mold for injecting a molding material into the mold. The mold defines at least one cavity in the shape of a element to be molded and at least one gate passage, each gate passage interconnecting a separate cavity with the nozzle. The shape of the gate passage permits a rapid curing of any residual molding material, and permits separation of the mold and the nozzle before the molding material in each cavity is cured. The nozzle is then used for a subsequent procedure or molding process while the molding material in the cavity cures. The nozzle defines a first bore and a second bore arranged longitudinally in sequence, and a side hole for introducing the molding material into the first bore. The nozzle includes a first plunger which is selectively reciprocally movable in the first bore, and a second plunger which is selectively reciprocally movable in the second bore and in a central bore defined in the first plunger. To charge a mold, the first plunger is moved to expose the side hole and control the flow of molding material into the second bore while the second plunger is extended into the second bore. The second plunger is raised to permit the first plunger to inject the molding material into each cavity via the second bore and each gate passage. The second plunger is then extended to purge any residue molding material from the nozzle.

Apparatus for the injection molding of semiconductor elements

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Taipei, Taiwan

Hohn Jong Hsiung