Infineon Technologies Ag

Hock Siang Chua

Chau Fatt Chiang

Swee Kah Lee

Chee Yang Ng

Kok Yau Chua

Stefan Macheiner

Josef Maerz

Matthias Steiert

Mei Chin Ng

Stefan Martens

Sook Woon Chan

Nurfarena Othman

Joseph Victor Soosai Prakasam

Hong Hock Tay

Kian Hong Yeo

A semiconductor package includes a frame having an insulative body with a first main surface and a second main surface opposite the first main surface, a first plurality of metal traces at the first main surface, and a first cavity in the insulative body. A thermally and/or electrically conductive material filling the first cavity in the insulative body and having a different composition than the first plurality of metal traces. The thermally and/or electrically conductive material provides a thermally and/or electrically conductive path between the first and the second main surfaces of the insulative body. A semiconductor die attached to the frame at the first main surface of the insulative body is electrically connected to the first plurality of metal traces and to the thermally and/or electrically conductive material filling the first cavity in the insulative body. A corresponding method of manufacture is also described.

Semiconductor package having a filled conductive cavity

A semiconductor package includes an electrically conductive lead-frame, including a first die paddle having a first opening, and a plurality of electrically conductive leads, a ridge formed around a perimeter of the first opening, and an electrically insulating molding compound. The electrically insulating molding compound includes an interior cavity being defined by a planar base surface and outer sidewalls, a second opening formed in the base surface, and an interior sidewall within the interior cavity. The molding compound is formed around the lead-frame with the first die paddle in the interior cavity. The first and second openings are aligned with one another so as to form a port that provides access to the interior cavity. The ridge and the interior sidewall form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity.

Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device

Growing community of inventors

Johor, Malaysia

Hock Siang Chua