Advanced Micro Devices Corporation

Hock Chuan Koh

Yiak Khian Heng

Jin Wee Lim

Kah Shan Chen

Justin Valentino Ajmer

Yeow Kwang Loh

Gim Leong Tan

A jig assembly for use in calibrating a thermocouple sensor includes a conductive member, a holder, and a fastener. The conductive member has a recess configured to receive a test wire and a test surface configured for thermal contact with the thermocouple sensor. The holder is adapted to receive the conductive member. The fastener is coupleable to the holder, wherein the holder and fastener form a recess configured to receive the test wire.

System and method for calibrating a thermocouple sensor

A sliding tray holder is coupled to an IC (integrated circuit) package test system having a plurality of test stations, for holding the trays of IC packages during testing of a high quantity of IC packages through the plurality of test stations. The sliding tray holder includes a platform for holding a first tray of untested IC packages and for holding a second tray of tested IC packages. Each untested IC package from the first tray of untested IC packages is loaded to at least one of the plurality of test stations for testing of the untested IC package such that the untested IC package becomes a tested IC package. The tested IC package is unloaded from one of the plurality of test stations to the second tray of tested IC packages. The platform holds the first tray of untested IC packages and the second tray of tested IC packages such that an operator does not hold the first tray and the second tray during loading of the untested IC packages to the plurality of test stations from the first tray and during unloading of the tested IC packages from the plurality of test stations to the second tray. A linear slide holds the platform and guides the platform holding the first tray and the second tray along the plurality of test stations as the platform is moved along the plurality of test stations during loading of the untested IC packages to the plurality of test stations from the first tray and during unloading of the tested IC packages from the plurality of test stations to the second tray. In this manner, the operator is relieved from constantly holding trays of IC packages during testing of a high quantity of IC packages.

Sliding tray holder for ease in handling IC packages during testing of the IC packages

A socket cover is mounted onto a socket for monitoring that an IC (integrated circuit) package is properly placed onto the socket with proper orientation and proper alignment. The socket cover includes a platform that is attached on top of the socket, and the platform has an opening for exposing pins of the socket when the platform is attached onto the top of the socket. The IC package is placed within the opening of the platform and onto the pins of the socket for testing of the IC package. A signal generator is disposed on a first side of the opening of the platform for emitting a signal across the opening toward a second side of the opening. A signal detector is disposed on the second side of the opening of the platform, and the signal detector is aligned with the signal generator such that the signal detector detects the signal emitted by the signal generator when the signal is not blocked. The signal detector detects the signal emitted by the signal generator when the IC package that is placed with proper orientation and proper alignment within the opening of the platform does not block the signal. Alternatively, the signal detector does not detect the signal emitted by the signal generator when the IC package that is placed with improper orientation or improper alignment within the opening of the platform does block the signal.

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Singapore, Singapore

Hock Chuan Koh