Laird Technologies Gmbh

Hoang Dinh Do

Douglas S McBain

Robert Howard Boutier, Jr

Jason L Strader

Michael S Plante

Richard Norman Johnson

Nathan Alan Greene

Jr Robert Howard Boutier

Exemplary embodiments are disclosed of low dielectric, low loss radomes. Also disclosed are materials for radomes according to exemplary embodiments.

Low dielectric, low loss radomes and materials for low dielectric, low loss radomes

According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.

Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide

Disclosed are exemplary embodiments of patterned electromagnetic interference (EMI) mitigation materials (e.g., EMI absorbers, thermally-conductive EMI absorbers, etc.) including carbon nanotubes. The carbon nanotubes may comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, and/or carbon nanostructures comprising a branched network of crosslinked carbon nanotube structures. For example, an EMI mitigation material may comprise a filled dielectric including a pattern of EMI absorbers. The filled dielectric comprises carbon nanotubes.

Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes

A low dielectric, low loss radome comprising microspheres integrated into a matrix. The microspheres reduce overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome.

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Canton, MA, United States of America

Hoang Dinh Do