Samsung Electronics Co., Ltd.

Ho Young Tang

Tae-Hyung Kim

Dong-Wook Seo

Sang-Yeop Baeck

Dae Young Moon

Eo Jin Lee

An integrated circuit includes a static random access memory (SRAM) device. The SRAM device includes an SRAM unit cell that includes a first output node to which a first pull-up transistor, a first pull-down transistor, and a second pull-down transistor are commonly connected, and a second output node to which a second pull-up transistor, a third pull-down transistor, and a fourth pull-down transistor are commonly connected. The first output node is connected to a first gate electrode, a second gate electrode, a first connection wiring line, a first node formation pattern, and a first active contact, and a layout of the first output node, the first gate electrode, the second gate electrode, the first connection wiring line, the first node formation pattern, and the first active contact forms a first fork shape.

Integrated circuit including static random access memory device

Provided are a three-dimensional (3D) semiconductor integrated circuit and a static random access memory (SRAM) device. The three-dimensional (3D) semiconductor integrated circuit includes: a first die including a power supply circuit a second die including an SRAM with a through-silicon-via (TSV) bundle region; a third die including a processor; and TSVs, each of which is provided on the TSV bundle region and extends from the TSV bundle region to the third die. The SRAM device includes: a bank array with banks, each of which includes sub-bit-cell arrays and a local peripheral circuit region arranged in a cross (+) shape between the sub-bit-cell arrays; and a global peripheral circuit region including a tail peripheral circuit region extending in a first direction and a head peripheral circuit region extending in a second direction, the tail peripheral circuit region and the head peripheral circuit region being arranged in a 'T' shape.

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Suwon-si, South Korea

Ho Young Tang