Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Ho Young Song

Won Soo Ji

Young Jin Cho

Yong Chun Kim

Ho Sun Paek

Jae Sung You

Won Ho Jung

Myoung Bo Park

Yong Il Kim

Do Yeon Kim

Sung Jae Kim

Hyun Kyung Kim

Jong In Kim

Seung Hwan Choi

Won Hoe Koo

Jae Chul Kim

Hong Min Kim

Wook Hee Lee

Kyung Seok Oh

Hyung Ky Back

Sung Min Yang

Hoon Shin

Young Su Yun

Young Chun Kim

Jeong Woo Park

Chong Wook Cho

Dong Yu Kim

Dong You Kim

Yun Tae Hwang

Jun Bum Lee

A light emitting diode (LED) module includes: a flexible substrate having a first surface on which a circuit pattern is disposed, and a second surface opposite the first surface; a plurality of light emitting diode (LED) chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern; an insulating reflective layer disposed on the first surface of the flexible substrate, and covering a portion of the circuit pattern; first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view.

LED module and LED lamp including the same

A white LED module includes a circuit board, at least one first LED light source on the circuit board and emitting a first white light having a first color temperature, at least one second LED light source on the circuit board and emitting a second white light having a second color temperature, higher than the first color temperature, a wiring structure in the circuit board to selectively drive the at least one first LED light source and the at least one second LED light source, and a transparent encapsulant on the circuit board, to cover the at least one first LED light source and the at least one second LED light source. The transparent encapsulant includes a transparent resin and a light-scattering powder in the transparent resin.

White light emitting diode module and lighting apparatus

A semiconductor memory device and a memory system having the same are provided. The semiconductor memory device includes a memory cell array including plural memory cell array blocks, and a refresh controller configured to control the memory cell array blocks to perform a normal refresh operation and a hammer refresh operation. The refresh controller controls one or more third memory cell array blocks excluding a first memory cell array block and one or more second memory cell array blocks adjacent to the first memory cell array block to perform the hammer refresh operation while the normal refresh operation is performed on the first memory cell array block among the memory cell array blocks.

Semiconductor memory device capable of performing a hammer refresh operation while performing a normal refresh operation and memory system having the same

A semiconductor light emitting device includes a wiring board including a mounting surface on which a first wiring electrode and a second wiring electrode are disposed; a semiconductor light emitting diode (LED) chip including a first surface on which a first electrode and a second electrode are disposed, the first surface facing the mounting surface, the semiconductor LED chip further including a second surface positioned opposite to the first surface, and side surfaces positioned between the first and second surfaces, the first and second electrodes being connected to the first and second wiring electrodes, respectively; and a reflective layer disposed on at least one of the second surface and the side surfaces of the semiconductor LED chip.

Semiconductor light emitting diode chip and light emitting device having the same

A lead frame includes a bonding part to bond to a semiconductor chip, a first trench in the bonding part along a first central axis, the first central axis dividing the bonding part into two parts, and second trenches in the bonding part along a second central axis, the second central axis dividing the bonding part into two parts, and the first and second central axes vertically intersecting each other.

Lead frame and semiconductor package including the lead frame

A semiconductor LED package includes a package body having first and second electrode structures and an LED chip connected to at least one of the first and second electrode structures using a wire. The LED chip includes a light emitting structure and first and second electrode parts. At least one of the first and second electrode parts includes a bonding electrode layer made of a material having the same composition as a material of the wire and bonded to the wire, and an uneven electrode layer disposed on the bonding electrode layer and having at least one through hole filled with the wire. The at least one through hole allows a top surface of the bonding electrode layer to be exposed therebelow.

Semiconductor light emitting diode package and lighting device using the same

A light emitting device package includes a frame unit including at least two lead frames spaced apart from one another and a light emitting region defined by a distance between the two lead frames; a light emitting device mounted on a surface of the frame unit such that the light emitting device is positioned across the light emitting region, and electrically connected to the lead frames; a wavelength conversion unit provided in the light emitting region, and configured to convert a wavelength of light emitted from the light emitting device and emit the light having the converted wavelength; and a reflective molding unit formed on the surface of the frame unit to cover the light emitting device.

Light emitting device package and method of manufacturing the same

A light emitting device includes: a substrate having opposed first and second main faces; a light emitting element mounted on the first main face of the substrate; and a driver integrated circuit (IC) formed in an area corresponding to a lower side of the light emitting element within the substrate, and adjusting the amount of current applied to the light emitting element. Since the circuit provided to drive a light emitting diode (LED) is integrated within the substrate, a compact light emitting device having an integrated structure can be obtained.

Light emitting device

There is provided a light emitting device package including: a package substrate; a blue light emitting device and a green light emitting device mounted on the package substrate; a flow prevention part formed on the package substrate and substantially enclosing the blue light emitting device; and a wavelength conversion part including a red wavelength conversion material and formed on a region defined by the flow prevention part to cover the blue light emitting device, so that white light having a high degree of color reproducibility may be emitted thereby.

A side-view type light emitting device includes a package body, a lead frame, and a light emitting diode (LED). The package body has a first surface provided as a mount surface, a second surface disposed on a side opposite to the first surface, and lateral surfaces disposed between the first surface and the second surface. The package body includes a recessed portion disposed on a lateral surface corresponding to a light emitting surface of the lateral surfaces. The lead frame is disposed in the package body. The LED chip is mounted on a bottom surface of the recessed portion. Protrusion parts protruding toward the LED chip are disposed in regions adjacent to the LED chip of facing inner sidewalls of the recessed portion, respectively.

Side-view type light emitting device and line light source type light emitting device

There is provided a method of fabricating a lithography mask, the method including: forming a transparent polymer layer on a surface of a first substrate where a convex-concave pattern is formed; separating the transparent polymer layer from the first substrate, the transparent polymer layer having a convex-concave surface formed by the convex-concave pattern of the first substrate transferred thereonto; depositing a metal thin film on the convex-concave surface; forming a viscous film on a second substrate; disposing the transparent polymer layer on the second substrate such that the viscous film and metal thin film are partially bonded together; and separating the transparent polymer layer from the second substrate such that a portion of the metal thin film bonded to the viscous film is removed, wherein a metal thin film pattern having the portion of the metal thin film removed therefrom is formed on the convex-concave surface.

Fabrication method of lithography mask and formation method of fine pattern using the same

There are provided a semiconductor light emitting device that can be manufactured by a simple process and has excellent light extraction efficiency and a method of manufacturing a semiconductor light emitting device that has high reproducibility and high throughput. A semiconductor light emitting device having a substrate and a lamination in which a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer are sequentially laminated onto the substrate according to an aspect of the invention includes a silica particle layer; and an uneven part formed at a lower part of the silica particle layer.

Semiconductor light emitting device and method of manufacturing the same

There is provided an LED testing apparatus. An LED testing apparatus according to an aspect of the invention may include: a first lighting unit generating first light and irradiating the first light onto an LED having an encapsulant including a fluorescent material excited by the first light to emit light having a longer wavelength than the first light; a second lighting unit generating second light having a longer wavelength than the first light to irradiate the second light onto the LED; an image acquisition unit receiving the light emitted from the fluorescent material and the second light reflected off the LED to acquire images of the LED; and an LED state determination unit determining whether the LED is acceptable or defective using the images of the LED acquired by the image acquisition unit.

LED testing apparatus and testing method thereof

A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface.

Growing community of inventors

Gyunggi-do, South Korea

Ho Young Song