Star Technologies, Inc.

Ho Yeh Chen

Choon Leong Lou

Li Min Wang

Hsiao Ting Tseng

Yi Ming Lau

A probing device includes a chuck configured to support a device under test (DUT), and includes a probe card disposed above the chuck. The probe card includes an inlet configured to convey a gas into the probe card, and an outlet configured to blow the gas at a predetermined temperature from the probe card toward the chuck. A method includes providing a chuck, a DUT disposed on the chuck and a probe card disposed above the DUT, and blowing a gas at a predetermined temperature from the probe card toward the DUT.

Probing device

The present disclosure provides a testing apparatus, a holding assembly and a probe card carrier. In some embodiments of the present disclosure, the testing apparatus includes a basic circuit board having a first surface and a second surface; a holding assembly disposed on the first surface; a signal transfer assembly disposed on the second surface and electrically connected to the basic circuit board; and a probe card carrier configured to carry a probe card. In some embodiments of the present disclosure, when the probe card carrier is assembled to the holding assembly, the probe card is electrically connected to the signal transfer assembly.

Testing apparatus, holding assembly, and probe card carrier

A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, a space transformer, an intermediary supporting element, an adhesive element, a plurality of electrical connection elements and a plurality of test probes. The space transformer is disposed on the main circuit board and has a first surface and a second surface opposite to the first surface. The first surface faces the main circuit board. The intermediary supporting element is disposed between the main circuit board and the first surface. The adhesive element is disposed between the intermediary supporting element and the first surface. The space transformer is attached to the intermediary supporting element through the adhesive element. The electrical connection elements are disposed between the main circuit board and the first surface. Each of the electrical connection elements passes through the intermediary supporting element and the adhesive element such that the space transformer is electrically connected to the main circuit board through the electrical connection elements. The test probes are disposed on the second surface and electrically connected to the space transformer.

Test assembly and method of manufacturing the same

A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, an intermediate dielectric board, an intermediate circuit board, a plurality of intermediate conductive elements and a plurality of test probes. The main circuit board includes a surface and a plurality of pads disposed on the surface. The intermediate dielectric board is detachably disposed on the surface of the main circuit board and includes a plurality of through holes. The intermediate circuit board is disposed on the intermediated dielectric board and includes a plurality of first pads, a plurality of second pads, a first surface and a second surface opposite to the first surface. The intermediate conductive elements are disposed in the through holes, respectively. Each of the intermediate conductive elements electrically connects one of the pads of the main circuit board and one of the first pads of the intermediate circuit board. The test probes are disposed on the second surface of the intermediate circuit board and respectively electrically connected to the second pads of the intermediate circuit board. Each of the test probes is electrically connected to the main circuit board through the intermediate circuit board and one of the intermediated conductive elements.

Test assembly

A testing device comprises a first probe member, a second probe member, and an insulation member. The first probe member comprises a tip portion for contacting a device being tested. The second probe member also comprises a tip portion for contacting the device being tested. The insulation member is located at or can be moved to a location between the tip portions of the first and second probe members.

Testing device

A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe.

High-precision semiconductor device probing apparatus and system thereof

A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain an optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.

Testing apparatus for light-emitting devices with a design for a removable sensing module

A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.

Growing community of inventors

Hsinchu, Taiwan

Ho Yeh Chen