Samsung Electronics Co., Ltd.

Ho-Soo Jang

Dong-Soo Lee

Hee-Sang Yang

Yo-Se Eum

Dong-Chul Han

Yong-Kyun Sun

Tai-Kew Choi

A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.

Semiconductor device fabrication process

A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

Equipment and method for cutting package

Growing community of inventors

Busan, South Korea

Ho-Soo Jang