Samsung Electro-mechanics Co., Ltd.

Ho Kyoum Kim

Hyung Chan Kwak

Gab Yong Kim

Young Jun Kim

Ju Chul Kim

Kwang Youel Raa

Hyoung Woo Nam

In Soon Yu

Disclosed herein is a camera module including: a lens part including a lens; a housing having the lens part coupled thereto; a bracket coupled to the housing; and a shaft mounted in the bracket and driving the lens part and the housing.

Camera module

A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.

Camera module package

Surveillance camera

The present invention relates to a method of manufacturing an image sensor module including attaching an image sensor on one side of a double-sided flexible printing circuit board (FPCB) provided with a window such that the image sensor module covers the window; and mounting at least one electric part on the other side of the double-sided FPCB on which the image sensor is attached.

Image sensor module, method of manufacturing the same, and camera module using the same

Provided is an optical sensor module including a printed circuit board (PCB) having a pad with a perforated portion formed in the central portion thereof; a lens disposed on the top surface of the pad so as to cover the perforated portion; one or more light sources disposed around the lens; an image sensor closely attached to the bottom surface of the pad; and a housing mounted to surround the outer periphery of the image sensor, the housing having the same height as that of the image sensor and the same size as that of the pad.

Non-contact optical sensor module

Disclosed is a method for packaging a pickup device, which is used for a digital optical instrument, and particularly a method for fabricating an image sensor module connected to a flexible PCB. The method according to the invention includes the steps of forming a printed circuit of a predetermined pattern on an upper surface of a transparent medium, forming a first bump and a second bump on the upper surface of the transparent medium, first bonding the first bump with a pattern of an image chip so as to be electrically connected to each other, secondly bonding the second bump with a circuit of a flexible PCB so as to be electrically connected to each other, and molding a rear surface of the flexible PCB, on which an image chip is mounted, by means of epoxy resin. The method according to the invention provides an effect of reducing weight, thickness, length and size of the module in comparison with the module fabricated under the conventional wire bonding method.

Growing community of inventors

Gyunggi-do, South Korea

Ho Kyoum Kim