Taiwan Semiconductor Manufacturing Comp. Ltd.

Ho-Ku Lan

Shih-Shiung Chen

Chen-Cheng Kuo

Ying-Chen Chao

Hung-Chih Chen

Ming-Fa Chen

Shin-Rung Lu

Wen-Jui Fu

A method is provided for forming features in a polyimide layer that is employed as an insulating layer or buffer layer during the fabrication of semiconductor devices or chip packaging structures. A pattern is formed in a photosensitive layer that has a high film retention after the development step and a crosslinked network that strengthens and stabilizes it for subsequent processing. The process involves exposing a negative tone photosensitive layer with a first exposure dose that is less than the normal dose used to image the material. The exposed layer is developed to provide a scum free substrate. A second exposure dose then strengthens the formed image by crosslinking unreacted components. First and second exposure doses are determined from a plot of film thickness loss vs. exposure energy. The method applies to photosensitive polyimide precursors as well as negative photoresists that are crosslinked by free radical or chemical amplification mechanisms.

Two step exposure to strengthen structure of polyimide or negative tone photosensitive material

The present invention discloses a liquid dispensing system and a method for dispensing liquid that includes two hermetically sealed tanks each having a liquid container with a conduit pipe connecting the two containers. A differential pressure exists between the two tanks such that a process liquid can be fed from the second container into a dispensing nozzle under the differential pressure and the gravity of the liquid without the need of a pumping system. The problems of gel formation normally observed in conventional dispensing systems can be eliminated. A high viscosity, short shelf life liquid can be most suitably dispensed by the present invention novel dispensing system and method.

Liquid dispensing system and method for dispensing

A photomask arrangement is disclosed to prevent the reticle patterns of a photomask from peeling caused by electrostatic discharge damage. The photomask includes: a substrate; a plurality of metal shielding layers formed on the surface of the substrate to provide the reticle patterns, wherein each two of the metal shielding layers are spaced apart by a clear scribe line; and a plurality of metal lines formed on the clear scribe line to connect the adjacent metal shielding layers, thereby increasing the effective surface area of the reticle patterns.

Photomask arrangement protecting reticle patterns from electrostatic

The present invention discloses a method for coating a polyimide precursor on an electronic structure incorporating the use of a silicon coupling agent without any bubble defect in the film deposited. The method can be carried out by flowing at least one inert gas through a deposition chamber and thereby keeping the relative humidity in the chamber at below 25% to carry away the formation of any water molecules and water vapor to prevent the formation of bubbles in the film deposited.

Method for depositing a polyimide film

A method is achieved for reducing the surface leakage current between adjacent bonding pads on integrated circuit substrates after forming a patterned polyimide passivation layer. When the polyimide layer is patterned to open contacts areas over the bonding pads, plasma ashing in oxygen is used to remove residual polyimide that otherwise causes high contact resistance, and poor chip yield. This plasma ashing also modifies the insulating layer between bonding pads resulting in an unwanted increase in surface leakage currents between bonding pads. The passivation process is improved by using a thermal treatment step in either a nitrogen or air ambient after the plasma ashing to essentially eliminate the increased surface leakage current and improve chip yield.

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Hsin-Chu, Taiwan

Ho-Ku Lan