Mirae Corporation

Ho Keun Song

Young Geun Park

Chul Ho Ham

Jae Bong Seo

Woo Young Lim

Chan Ho Park

Byoung Dae Lee

Hyun Joo Hwang

Jung Ug Han

A tray transferring apparatus for transferring a handling tray on which semiconductor devices are mounted prevents the semiconductor devices from being scattered or separated from the handling tray. The tray transferring apparatus includes a fixing means installed on a main frame for supporting a fixed tray, a correcting means installed on the main frame for correcting the position of the fixed tray, a gripping means installed on the main frame for gripping a handling tray, and at least one sensor for sensing gripper plates and the handling tray. A fixed tray is held by the fixing means, and right/left inclination of the fixed tray is corrected by the correcting means. An upper portion of a handling tray holding semiconductors is covered by the bottom of the fixed tray and is gripped by the gripping means.

Tray transferring apparatus with gripper mechanism

A transfer device of a handler for testing semiconductor devices is provided in which a pitch between each of a plurality of picker heads may be adjusted without replacing a cam plate. The transfer device may include a base part, a plurality of picker heads movably mounted on the base part, and a cam plate movably mounted on the base part and having a plurality of inclined cam grooves formed therein. Each picker head is connected to a corresponding cam groove by a connection part extending therebetween, with an end of each connection part movably coupled to its respective cam groove. A driving unit reciprocates the cam plate so that, as the ends of the connection parts move within the cam grooves, a position of the picker heads may be varied.

Transfer device of handler for testing semiconductor device

A socket assembly for testing semiconductor devices includes a socket board electrically connected to an outside testing device, and a socket guide which covers the socket board. The socket guide has an open part to receive the semiconductor device and allows pins on the semiconductor device to couple with connection pins on the socket board. A spacer may be interposed between the socket board and the socket guide to maintain a predetermined distance between the semiconductor device and the socket board. In this manner, the balls or the leads of each semiconductor device may be pressed onto connection pins of the socket to a predetermined depth, even when the semiconductor devices have different thicknesses.

Socket assembly for testing semiconductor device

A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices. The handler includes a loading station, an unloading station, test trays, an exchanging station comprising a horizontal moving unit for horizontally moving a selected one of the test trays by a predetermined pitch at a working place, a test station in which at least one test board having a plurality of test sockets to be electrically connected with semiconductor devices is mounted, the test station performing a test while connecting the semiconductor devices in one of the test trays, which is fed from the exchanging station to the test station, to the test sockets, device transfer units for transfer the semiconductor devices between the loading station and the exchanging station and between the exchanging station and the unloading station, respectively, and a tray transfer unit for transfer the test trays between the exchanging station and the test station.

Handler for testing semiconductor devices

A test tray for a handler for testing semiconductor devices is disclosed which is capable of reducing the costs and time taken for replacement of carrier modules, and achieving an enhancement in workability. The test tray includes a frame, pockets mounted to the frame while being uniformly spaced apart from one another, each of the pockets including a seat on which a semiconductor device is to be seated, latches mounted to the frame to be arranged in pairs for respective pockets such that the latches of each latch pair face each other at opposite sides of an associated one of the pockets, respectively, each of the latches being movable between a first position where the latch holds a semiconductor device seated in the seat of the associated pocket and a second position where the latch releases the held state of the semiconductor device, and latch operating members each mounted to the frame, and adapted to move an associated one of the latches between the first position and the second position, each of the latch operating members being separate from the associated latch.

Test tray for handler for testing semiconductor devices

A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.

Device for compensating for heat deviation in a modular IC test handler

Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is seated thereon, a housing over the carrier module body, a supplementary housing fitted in a lower part of the housing to be movable in up/down directions, for elastic contact with the carrier module body by a first elastic member fitted inside of the housing, a vacuum tube in the supplementary housing so as to be in communication with the pass through hole in the carrier module body, at least one pair of latches in a lower part of the carrier module body to move apart or close in an outer or inner side, for holding or releasing the semiconductor device seated on the carrier module body, a latch button fitted in an upper part of the carrier module body so as to be movable in up/down directions, and coupled to the latch with a connection pin for moving in up/down directions by an external force, to making the latch to move, and a second elastic member for elastic supporting of the latch buttons on the carrier module body, thereby, when the semiconductor device is brought into contact with the test socket, and tested, holding the semiconductor device with a vacuum formed through the pass through hole in the carrier module body and the vacuum tube in a state the latch releases the semiconductor device.

Carrier module

Carrier module for a semiconductor device test handler including a carrier module body, a device seating part in an underside part of the carrier module body, at least one pair of first latches at opposite sides of the device seating part arranged opposite to, and movable away from, or close to, each other, for holding, or releasing opposite side parts of the semiconductor device seated on the device seating part, at least one pair of second latches rotatably fitted on opposite sides of the first latch, for holding an underside part of the semiconductor device seated on the device seating part, and releasing the semiconductor device interlocked with a releasing action of the first latch, a latch button fitted in an upper part of the carrier module to move in up/down directions and coupled to one end of the first latch, for moving up and down to make the first latch to move, and a first elastic member, and a second elastic member for elastic supporting of the first latch, and the second latch, thereby securely holding, transferring, and bringing the semiconductor device into contact with the test socket, for testing.

Growing community of inventors

Seongnam-si, South Korea

Ho Keun Song