Samsung Electronics Co., Ltd.

Ho Jun Kwon

Joon Hyuk Kim

Sang Yeol Kang

Ki Yeon Park

Youn Soo Kim

Jae Hyoung Choi

Cha Young Yoo

A method of manufacturing a semiconductor device, the method including: preparing a semiconductor substrate including a mold layer and a support layer disposed on the mold layer; forming multiple holes that pass through the mold layer and the support layer; forming multiple bottom electrodes in the holes; exposing at least a portion of the bottom electrodes by removing at least a portion of the mold layer; removing a portion of the bottom electrodes from an exposed surface of the bottom electrodes; and sequentially forming a dielectric layer and a top electrode layer on the bottom electrodes.

Growing community of inventors

Seoul, South Korea

Ho Jun Kwon