Samsung Electro-mechanics Co., Ltd.

Kolon Industries, Inc.

Other

Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Ho Joon Park

Chang Hyun Lim

Seog Moon Choi

Sung Jun Lee

Woong Lin Hwang

Sang Hyun Choi

Sang Hyun Kim

Si Min Kim

Kyoung Soo Chae

Du H Kim

Hak M Kim

Moo S Rhim

Ink S Han

Youn Soo Kim

Yeong Gyu Lee

In Won Kang

Seog C Yoo

Sa Ng Park

Jong T Park

Seung Min Lee

Moon Chul Lee

Sang Jin Kim

Duck Hwan Kim

Hyun Jun Kim

Jeong Suong Yang

Dong Sik Yoo

Byeung Gyu Chang

Hee Ju Son

Sang Hyun Yi

Sang Hwan Oh

Ha Yoon Song

Sang Bong Park

John T Park

Suck H Lee

Jung I Jin

Seo W Kim

Young Jae Kim

Seog O Yoo

Khudoyberdiyev Khurshidjon

An acoustic resonator includes a substrate having via holes provided therein and having a membrane structure formed on a first surface of the substrate, and a cap accommodating the membrane structure and bonded to the substrate. The cap includes a support block in contact with the membrane structure.

Acoustic resonator and method for manufacturing the same

In examples, there is provided a bulk acoustic wave resonator including a substrate; a resonating part including a first electrode, a piezoelectric layer, and a second electrode, laminated on an upper surface of the substrate, a cap bonded to the substrate by a bonding agent; and a sealing layer formed on an externally exposed surface of the bonding agent. This structure provides for a bulk acoustic wave resonator with improved reliability.

Bulk acoustic wave resonator and method for manufacturing the same

Disclosed herein is a touch panel, including: a transparent substrate; an electrode formed in a mesh pattern on the transparent substrate; and a wiring formed in a wavy pattern on the transparent substrate and connected to the electrode, the wiring having curve shape of first peaks and second peaks alternately continuing along a longitudinal direction.

Touch panel

Disclosed herein is a touch panel capable of preventing a moire phenomenon from being generated by forming an electrode pattern so as to have rotational symmetry rather than translation symmetry.

Touch panel with electrode pattern including regular pentagons

Disclosed herein is a connection structure between a substrate and a flexible printed circuit board (FPCB) for a touch panel, including: a substrate; first sensing electrodes; second sensing electrodes; first electrode wirings; second electrode wirings; and a flexible printed circuit board connected to the substrate so as to be electrically connected to the first and second electrode wirings, wherein a first connection portion of the first electrode wiring and a second connection portion of the second electrode wiring to which the flexible printed circuit board is electrically connected are formed on the upper and lower surfaces of the substrate, respectively, so as to face each other in a vertical direction. Therefore, the flexible printed circuit substrate may be connected to the substrate by a single assembling process.

Connection structure between substrate and FPCB for touch panel

Disclosed herein is a digitizer, including: an input unit in which a magnet is embedded; a driving coil in which source supplies to induce a line of magnetic force; a sensing coil in which voltage or current is induced by the line of magnetic force; and a controlling unit supplying the source to the driving coil and measuring the voltage or the current induced in the sensing coil, wherein the controlling unit senses a change amount in the voltage or the current induced in the sensing coil to calculate a coordinate, when the voltage or the current induced in the sensing coil is changed by the magnet.

Digitizer

Disclosed is a multimedia data transmitter that can transmit multimedia data such as image, voice and control signal whose media are different from each other through an optical transmission medium such as plastic or glass optical cables to a short or long distance area. The multimedia data transmitter includes: a digital signal processing logic, converting multimedia data transmitted in different transmission formats into data of a single transmission format, converting parallel image data into serial image data; an interface control logic, generating a control signal for transmission of the data converted by the digital signal processing logic, interfacing interface data; an optical driver, performing optical transmission of the serial data generated by the digital signal processing logic according to the control signal generated by the interface control logic, processing an optical-to-electrical converted signal.

Transmitter of multimedia data

Disclosed is a multimedia data receiver using an optical cable that can receive multimedia data such as an image, voice and control signal whose media are different from each other through an optical transmission medium such as plastic or glass optical cables in a short or long distance area. The multimedia data receiver includes: an optical driver, amplifying a received signal of a single transmission format that is optical-to-electrical converted by an optical module connected to an optical cable, converting a serial data for transmission into an analog signal, performing optical transmission through the optical module; an interface control logic, extracting a control signal from the signal received through the optical driver, interfacing control data; and a digital signal processing logic, converting the signal received through the optical driver into data of the original transmission format through converting the signal into a digital signal and decoding the digital signal, deserializing a serial image data, transmitting the data to a display device connected thereto.

Receiver of multimedia data

The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

Light emitting diode package and fabrication method thereof

Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive line formed in the plurality of ceramic green sheets is prepared. Then, at least one probe pin structure connected to the interlayer circuit is formed by selectively removing the plurality of photosensitive ceramic sheets having a ceramic powder and a photosensitive organic component on the ceramic laminated body necessarily, and by filling a metal material in a region from which the plurality of photosensitive ceramic sheets have been removed. Then, a ceramic substrate having the at least one probe pin structure is provided by simultaneously firing the ceramic laminated body and the photosensitive ceramic sheets, and by removing the photosensitive ceramic sheets.

Method of manufacturing ceramic probe card

The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.

Light emitting diode package including monitoring photodiode

There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.

LED package using Si substrate and fabricating method thereof

An LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The LED package includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.

Light emitting diode package with protective function against electrostatic discharge

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Seoul, South Korea

Ho Joon Park