Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Ho Jeong Lim

Ji Hyun Kim

Byong Jin Kim

Ji Young Chung

Tae Yong Lee

Jae Min Bae

Ju Hoon Yoon

Jin Young Khim

Jae Ung Lee

Yung Woo Lee

Dong Hyun Bang

EunNaRa Cho

Wook Choi

Min Chul Shin

Chang Hun Kim

KooWoong Jeong

Kwang Woong Ahn

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.

Semiconductor device and manufacturing method thereof

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

Semiconductor package and manufacturing method thereof

Growing community of inventors

Seoul, South Korea

Ho Jeong Lim