Samsung Electronics Co., Ltd.

Ho-Jeong Choi

Young-Soo An

Sang-Hoon Lee

Jung-Hyeon Kim

Jeong-Ho Bang

Kwang-Kyu Bang

Jong-won Han

Jung-hyeon Kim

Se-jang Oh

Seok Goh

Kyeong-seon Shin

Gyu-Yeol Kim

Byoung-jun Min

Kun-gu Lee

Dae-Jong Kim

Min-Gu Kim

Kyoung-Suk Lyu

Seung-Gyoo Choi

Chan-Soon Park

Sang-Sik Lee

Bo-Woo Kim

A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.

Test socket, and test apparatus with test socket to control a temperature of an object to be tested

An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.

Electrical signal transmission module, method of transmitting electric signals and electrical inspection apparatus having the same

There is provided a multilayer type test board assembly for high-precision inspection. The multilayer test board assembly comprises: a plurality of test boards separated from each other according to their functions, having input/output signal terminals, and including at least one test board each having a first section where first mounting devices sensitive to an influence of electrical signals are mounted and a second section where second mounting devices insensitive to an influence of electrical signals are mounted; spacers that arrange the test boards in parallel by spacing apart the test boards by predetermined intervals; connection cables connected to the input/output signal terminals of the test boards; and a signal shielding fence formed on each of the at least one test board so as to protect the first mounting devices from electrical signals generated by the second mounting devices.

Multilayer type test board assembly for high-precision inspection

A device and method of manufacturing a fuse region are disclosed. The fuse region may include an interlayer insulating layer formed on a substrate, a plurality of fuses disposed on the interlayer insulating layer, and fuse isolation walls located between the fuses, wherein each of the fuse isolation walls may include lower and upper fuse isolation patterns.

Fuse regions of a semiconductor memory device and methods of fabricating the same

A method of and testing jig for sequentially testing front and rear surfaces of a semiconductor chip is shown. The testing jig includes a support package having a first cavity over which the semiconductor chip mounts; an infrared filter affixed relative to the first cavity and attached to a rear surface of the semiconductor chip; and a test substrate having a second cavity exposing the infrared filter and upon which the support package mounts. Front and rear surfaces of the semiconductor chip can be conveniently and sequentially tested. Because the testing jig includes the infrared filter and the heat pad, heat can be easily transmitted to the defective chip.

Method of testing a semiconductor chip and jig used in the method

Growing community of inventors

Yongin-si, South Korea

Ho-Jeong Choi