Mpi Corporation

Mjc Probe Inc.

Ho-Hui Lin

Wei-Cheng Ku

Chih-Hao Ho

Chia-Tai Chang

Chien-Ho Lin

Jun-Liang Lai

Horng-Chuan Sun

Te-Chen Feng

Chih-Chung Chien

Chien-Huei Huang

Ai-Chuan Chang

Jia-Chi Ho

A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.

Probe for high frequency signal transmission

Probe for high frequency signal transmission and probe card using the same

A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.

Probing device

Growing community of inventors

Hsinchu Hsiang, Taiwan

Ho-Hui Lin