Hyundai Motor Company

Hiwon Lee

Hyunsoo Kim

Ilseon Yoo

Soon-myung Kwon

Dong Gu Kim

Yong Sung Lee

Soon-myung Kwom

HyunJin Jung

An acceleration sensor includes: a moving electrode extending in at least one of a first direction and a second direction perpendicular to the first direction, and including a plurality of planar patterns connected with each other; and an opposing electrode forming a capacitance with the moving electrode, wherein the plurality of planar patterns include: a first frame pattern; a first anchor pattern fixing the moving electrode to a surrounding structure; a first spring pattern connecting the first frame pattern and the first anchor pattern and having a stretching direction of the first direction; a second spring pattern connecting the first frame pattern and the first anchor pattern and having a stretching direction of the second direction; a wing pattern; and a third spring pattern connecting the first frame pattern and the wing pattern and having a stretching direction of a third direction perpendicular to the first and second directions.

Acceleration sensor and manufacturing method thereof

A switching type six-axis force-torque sensor is provided which includes: a sensor substrate attached to a structural body to be measured. A first measuring unit is installed at one side in respect to a central portion of the sensor substrate and measures strain and a second measuring unit is installed on the sensor substrate at a position that faces the first measuring unit in respect to the central portion and measures strain. Further, a third measuring unit is installed at a position that is orthogonal to a connecting line, which connects the first measuring unit and the second measuring unit, and measures strain and a fourth measuring unit is installed at a position that faces the third measuring unit in respect to the central portion and measures strain.

Switching type six-axis force-torque sensor and six-axis force-torque measuring apparatus using the same

A method of joining semiconductor substrates includes: forming an alignment key on a first semiconductor substrate; forming a first protrusion and a second protrusion, and an alignment recess positioned between the first protrusion and the second protrusion on a second semiconductor substrate; forming a first metal layer and a second metal layer on the first protrusion and the second protrusion, respectively; and joining the first semiconductor substrate and the second semiconductor substrate, in which the alignment key is positioned at the alignment recess when the first semiconductor substrate and the second semiconductor substrate are joined.

Method of joining semiconductor substrate

A method of joining semiconductor substrates, which may include: forming an alignment key on a first semiconductor substrate; forming an insulating layer on the first semiconductor substrate and the alignment key; forming a first metal layer pattern and a second metal layer pattern on the insulating layer; forming a first protrusion and a second protrusion, and an alignment recess positioned between the first protrusion and the second protrusion on a second semiconductor substrate; forming a third metal layer pattern and a fourth metal layer pattern on the first protrusion and the second protrusion, respectively; and joining the first semiconductor substrate and the second semiconductor substrate, in which the alignment key is positioned at the alignment recess when the first semiconductor substrate and the second semiconductor substrate are joined, is provided.

Disclosed is a strain gauge type force-torque sensor and a method for manufacturing the same. More specifically, a first sensor structure having a convex part on a bonding surface thereof and a second sensor structure having a concave part bonded to the convex part of the first sensor structure are formed. The gauge film is formed by installing a strain gauge on a flexible film. The gauge film is compressively interposed between the bonding surface of the first sensor structure having the convex part and a bonding surface of the second sensor structure having the concave part to initially deform the gauge film. The first sensor structure and the second sensor structure are fixed to each other in a state where the gauge film is initially deformed.

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Seoul, South Korea

Hiwon Lee