Taiho Kogyo Co., Ltd.

Hitoshi Wada

Takashi Tomikawa

Hiromi Yokota

Shigeyuki Suga

Daisuke Yoshitome

There is provided a technique which can realize both of conformability and fatigue resistance. A sliding member and a slide bearing include a base layer and a coating layer provided on the base layer and having a sliding surface on which a counter material slides, and are characterized in that the coating layer is formed of a soft material which is softer than that for the base layer; and that, in the sliding surface, crystal grains of the soft material having an average grain diameter of 0.1 &#x3bc;m or more and 1 &#x3bc;m or less are aggregated into lumps, thereby forming aggregates having an average diameter of 3 &#x3bc;m or more and 30 &#x3bc;m or less.

Sliding member and slide bearing

In a method, in which a plain bearing alloy layer is bonded to a surface of a backing steel sheet, and, a Bi-based overlay layer is then deposited on the plain bearing alloy layer by electroplating, replacement of Bi with the backing steel sheet and deposition of Bi on the backing steel sheet are prevented. Prior to the step of electroplating of the Bi-based overlay layer, the following metals and the like are formed on at least the back surface of the backing steel sheet. An electrochemically more noble metal than Bi, an electrochemically more base metal than Bi and capable of forming a passivation state, or resin.

Method for producing sliding member, sliding member, and substrate material of sliding member

Seizure resistance and wear resistance of Cu&#x2014;Bi&#x2014;In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu&#x2014;In cuprous alloy powder and Cu&#x2014;Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu&#x2014;Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu&#x2014;In containing Cu-based powder to said Cu&#x2014;Bi containing Cu-based powder.

Process for production of sintered copper alloy sliding material and sintered copper alloy sliding material

The present invention discloses a sliding member, comprised of a base layer including soft particles made of a soft material softer than a matrix and deposited in the matrix, and a soft layer made of the soft material formed on a surface of the base layer, wherein: the soft layer includes an epitaxial growth portion that is epitaxially grown from the soft particles.

Sliding member and sliding bearing

A sliding member includes a base layer including soft particles made of a soft material softer than a matrix and deposited in the matrix, and a soft layer made of the soft material formed on a surface of the base layer. A boundary portion is formed between crystal grains that have a unique crystal grain structure of the soft particles and crystal grains that have a unique crystal grain structure of the soft layer. An anodic oxidation film of the soft material is formed on the boundary portion.

The copper alloy (lining) prevails in an overwhelmingly large amount in a plain-bearing layer structure. Cu of the plain bearing copper-alloy diffuses into the Sn-based overlay diffuses into the Sn-based overlay and detrimentally impairs the performance of the overlay. The present invention takes a measure against this problem. An Sn-based overlay having a thickness of 3 to 19 &#x3bc;m is deposited by electro-plating without an intermediate layer for diffusion prevention on a plain-bearing layer, which contains Sn and Ni in a total amount of more than 4 mass % to 20 mass % (the minimum amount of Sn is 4 mass %) and has a hardness of Hv 150 or less.

Growing community of inventors

Aichi, Japan

Hitoshi Wada