Almex Inc.

Fujitsu Corporation

Permelec Electrode Ltd.

Hitoshi Usuda

Kazuhiro Hirao

Kenji Mimura

Kenichi Ueno

Eishiro Kawana

Ryoei Yamakawa

A method of applying a coating material to two surfaces of a plate includes the steps of applying the coating material to the two surfaces simultaneously such that holding areas in the absence of the coating material are provided on the two surfaces in proximity of side ends of the plate with respect to a travel direction of the plate, and conveying the plate by holding the holding areas.

Method of applying a coating material to a plate with conveying rollers

According to the present invention, an upper electrode and a lower electrode are integrally assembled with insoluble electrodes and diaphragmn in diaphragm electrode structure. Small holes are furnished on the upper electrode, and the diaphragm of the upper electrode is installed obliquely with degassing means. By simply carrying the objects to be plated in horizontal direction, uniform and high quality electroplating can be continuously performed with extensive increase in productivity, while enjoying all of the benefits such as shorter interpolar distance between two electrodes, compact design of the apparatus, saving of expensive additives, etc. Further, the inspection of the diaphragm and the like can be rapidly and easily accomplished, and perfect protection of the diaphragm is assured, thus providing a horizontal carrying type electroplating apparatus suitable for practical use.

Horizontal carrying tape electroplating apparatus

Growing community of inventors

Kanuma, Japan

Hitoshi Usuda