Nippon Mektron Limited

Hitoshi Uchida

Takahisa Akatsuka

Manabu Ohrui

Fumio Akama

Hideaki Tanaka

Kazuki Ozaki

Ryoichi Yoshimura

Koji Okano

A switch module is provided with a circuit substrate that has a metal dome sheet mounted on a surface thereof which is arranged in opposition to a key substrate, a light guiding sheet that is arranged between the key substrate and the circuit substrate, an LED, and a reflector that makes the light emitted from the LED incident into the light guiding sheet from an end thereof, wherein key parts are able to be illuminated by the switch module. At an inner side of the reflector in the light guiding sheet, there is formed a printed pattern of white ink for scattering light on an optical path of the light which transmits through a first surface from the vicinity of an edge portion of the reflector.

Switch module

In a switch module which is arranged in opposition to a key substrate, the switch module is provided which is able to reduce an amount of light leaking out from the vicinity of an end of a light guiding member in the direction of key parts, so that the key parts can be illuminated in a uniform manner by the light which advances in the interior of the light guiding member. A switch module is provided with a circuit substrate that has a metal dome sheet mounted on a surface thereof which is arranged in opposition to a key substrate, a light guiding sheet that is arranged between the key substrate and the circuit substrate, an LED, and a reflector that makes the light emitted from the LED incident into the light guiding sheet from an end thereof, wherein key parts are able to be illuminated by the switch module.

A method for easily making a barrier for preventing overflow of interlayer insulating resin in a cable-fitted multi-layer FPC that uses bumps for connecting the layers, and a barrier having a structure that can easily be made. In a method for manufacturing a multi-layer flexible printed circuit board including a circuit section, a cable section that is connected to the circuit section, the circuit section having a multi-layer structure of insulating resin arranged between multiple layers of metal foil, a barrier, that stops the insulating resin from overflowing, has a two-row configuration and is formed on a metal foil that constitutes an outermost conductive layer in the multi-layer flexible printed circuit board, and the metal foil and the insulating resin are laminated to form the multi-layer flexible printed circuit board.

Growing community of inventors

Minato-ku, Japan

Hitoshi Uchida