Aisin Seiki Kabushiki Kaisha

Hitoshi Tauchi

Hirotsugu Sugiura

Kiyotaka Nakai

Akio Inagaki

Masato Itakura

Satoru Hori

Toshihiro Nakano

Atsushi Tomita

Satoru Ogawa

Hiroyasu Kojima

Kazuo Ebisumori

Joji Hachisuka

Makoto Yamazaki

Masayoshi Ando

Noburo Ebina

A thermoelectric module which includes case , heat-radiation side insulating substrate , heat-absorption side insulating substrate , first soldering layer formed of a first soldering agent to connect the heat-radiation side insulating substrate and the case , a plurality of P-type and N-type semiconductor chips interposed between the heat-radiation side insulating substrate and the heat-absorption side insulating substrate , the plurality of P-type and N-type semiconductor chips being arranged alternately, and a second soldering layer ( ) formed of a second soldering agent to connect the heat-radiation side insulating substrate and one end of each of the plural P-type and N-type semiconductor chips (the heat-absorption side insulating substrate and the other end of each of the plural P-type and N-type semiconductor chips), the first soldering agent and the second soldering agent being identical in raw material.

Thermoelectric module and method of producing the same

A thermoelectric module includes a case, a insulating base plate for a exoergic side, a insulating base plate for endoergic side, a first soldering layer which joins the insulating base plate for the exoergic side to the case via a first soldering material, and a second soldering layer which joins P-type and N-type semiconductor tips to the insulating base plate for an exoenergic side and a insulating base plate for an endoergic side, using second soldering material. The melting point temperature of the first soldering material for the first soldering layer is higher than the melting point temperature of the second material for the second soldering layer.

Thermoelectric module and process for producing thermoelectric module

A method for producing a thermoelectric semiconductor includes an ingot production step for producing an ingot of a thermoelectric semiconductor and an integrating step for integrating a plurality of the ingots by plastic deforming the ingots to produce an integrated ingot of the thermoelectric semiconductor. The large size of the thermoelectric semiconductor ingot having uniform performance and mechanical strength can be produced by integration of two or more ingots. Therefore, many wafers can be produce at one time in the slicing step, and productivity is improved. Further, two or more ingots are integrated by plastic deformation so that the connecting strength of the connecting interface is strong.

Method for producing a thermoelectric semiconductor

A thermoelectric device includes a thermoelectric element composed of principally thermoelectric material, a counter element adhered to the thermoelectric material. A solder layer lies between the thermoelectric element and the counter element and adheres the thermoelectric element to the counter element. A restraining layer prevents the solder ingredient of the solder layer from spreading into the thermoelectric element. The restraining layer is composed of a first layer to prevent the solder ingredient of the solder layer from spreading into the thermoelectric element and a second layer composed of material having a higher wetting property than the first layer with respect to the solder layer.

Thermoelectric device

In order to provide a high mechanical strength and a progressive performance index resulting from an improved electric conductivity, a thermoelectric semiconductor is made by arranging a plurality of extruded bar-shaped thermoelectric semiconductor materials B,in a bundle. The resulting bar-shaped thermoelectric semiconductor materials B,are sintered and integrated concurrently by applying a force to each bar-shaped thermoelectric material B,along a direction L,perpendicular to an axis L,thereof. This causes flows of materials, thereby further orientating cleavage planes which causes an advanced orientation effect.

Method of producing thermoelectric semiconductor

A process for producing a sintered thermoelectric semiconductor includes a first step of forming bulk crystals of a thermoelectric semiconductor and a second step of hot extrusion. The second step includes substeps of placing the bulk crystals in the cavity of a heated extrusion die, pushing the ram into the cavity, thereby compressing and crushing the bulk crystals and turning them into a molten or semi-molten state, and finally extruding the molten or semi-molten crystals, thereby sintering them and forming a sintered thermoelectric semiconductor.

Process for producing sintered thermoelectric semiconductor and sintered

A multiple thermoelectric cooling device in which both ends of thermoelectric elements in first and second cooling units are soldered to the corresponding electrodes. In the first cooling unit, the melting point of a solder for soldering is higher, while in the second cooling unit the melting point of another solder for soldering is lower. Thus, in case soldering is performed in the second cooling unit with the same placed on the first cooling unit, the soldered connection in the first cooling unit will not be remelted.

Multistage thermoelectric cooling device

A multi-stage electronic cooling device has an electrically insulating base plate, a first thermoelectric converter portion having the Peltier effect and disposed on one surface of the electrically insulating base plate, and a second thermoelectric converter portion having the Peltier effect and disposed on another surface of the electrically insulating base plate. A through hole is formed in the electrically insulating base plate. An electrically conductive member interconnects the first thermoelectric converter portion and the second thermoelectric converter portion via an interior of the through hole. In an optional construction, the electrically conductive member is formed of an electrically conductive coating formed on the inner peripheral surface of the through hole, and the first and second thermoelectric converter portions are disposed between the electrically insulating base plate and two additional insulating base plates at opposite sides thereof

Multi-stage electronic cooling device

Ultravioletsetting resin composition contains fragmentary quartz glass powder in the ratio of 50 to 200 parts to 100 parts of the ultravioletsetting resin. The surface hardness of the ultravioletsetting resin of the present invention is increased in a short time by the application of ultraviolet rays.

Ultravioletsetting resin composition

A reservoir cap includes a cylinder portion of molded resin and surrounding an outer circumferential surface of an opening portion of a reservoir body, and a flat portion unitarily formed on the cylinder portion and closing the opening portion of the reservoir body. A transparent film is insert-molded to the outer surface of the flat portion. Descriptive characters are formed at an inner surface of the film. The film is made from the same material as the flat portion. It is therefore possible to obtain a high adhesion between the film and the flat portion of the reservoir cap because they have the same melting point. Therefore, it is possible to provide an improved reservoir cap having descriptive characters which are easily seen from the outside thereof at the flat portion, while ensuring a high chemical resistance and a high durability against the operational fluid. Furthermore, it is possible to improve the appearance of the reservoir cap while ensuring the high chemical resistance and the high durability against the operational fluid.

Reservoir cap

A vibration wave motor includes a stator with an upper surface at which is generated a travelling vibration, a rotor with a lower surface rotatably mounted on the upper surface of the stator, and an urging device for developing a frictional force between the upper surface of the stator and the lower surface of the rotor. A sheet member is attached to either the upper surface of the stator or the lower surface of the rotor and the sheet member includes a base member having ultra heat-resistant properties, a fluorine-contained resin and a filler in the form of fibers.

Vibration wave motor

A method of sealing electric and electonic parts, comprising employing two different ultraviolet-curing resins for upper and lower layer portions, respectively, the resin employed for the upper layer portion having a smaller specific gravity than that of the resin for the lower layer portion before the resins are cured, and simultaneously curing the resins by irradiation with an ultraviolet ray. The ultraviolet-curing resin employed for the upper layer portion is an epoxy acrylate or epoxy resin, while an urethane acrylate ultraviolet-curing resin is employed for the lower layer portion, and the thickness of the ultraviolet-curing resin employed for the upper layer portion is set at from 0.5 mm to 3 mm.

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Anjo, Japan

Hitoshi Tauchi