Sony Corporation

Hitoshi Tamashiro

Yasunori Kijima

Yuichi Iwase

Yukio Sato

Shoji Terada

Kimitaka Kawase

A display unit includes a plurality of panels joined to each other into one display screen. Each of the panels is formed by using organic EL devices. In this display unit, a seal material is applied to a joint portion between adjacent two of the panels in such a manner as to cover the joint portion, to thereby suppress permeation of moisture, air, and the like in the organic EL devices.

Display unit

A method of manufacturing a display unit capable of manufacturing a large-screen display unit with high display quality without upsizing manufacturing facilities is provided. Device substrates on which a pixel including the organic light-emitting devices is formed are aligned on the same plane so as to face a sealing substrate. While the device substrates and the sealing substrate are bonded together with an adhesive resin for sealing in between, the adhesive resin for sealing is extruded from a seam portion to the backside of the seam portion so as to fill the seam portion with the adhesive resin for sealing. The backside of the seam portion can be securely sealed through a simple step. The method is suitable for a large-scale display unit using top-emitting organic light-emitting devices. A back sealing member may be disposed on the backside of the seam portion with the extruded adhesive resin for sealing in between. After that, the adhesive resin for sealing is cured.

Method of manufacturing display unit wherein sealing material is extruded from a seam portion between plurality of device substrates

Light-emitting devices are formed on a support substrate, whereas a black matrix is provided on a transparent opposed substrate. The support substrate and the opposed substrate are adhered to each other in the condition where the display devices are sealed with an adhesive resin and the adhesive resin is charged between the support substrate and the opposed substrate. In this case, alignment of the support substrate and the opposed substrate is conducted so that the surface of the opposed substrate provided with the black matrix is faced to the surface of the support substrate provided with the light-emitting devices and the black matrix is disposed faced to the spaces between the light-emitting devices. The alignment is conducted by disposing alignment marks provided on the surface of the support substrate provided with the light-emitting devices and alignment marks provided on the opposed substrate into a predetermined condition.

Growing community of inventors

Kanagawa, Japan

Hitoshi Tamashiro