Hitachi-High-Technologies Corporation

Hitachi High-Tech Corporation

Hitoshi Sugahara

Yasutaka Toyoda

Hiroyuki Shindo

Shinichi Shinoda

Yutaka Hojo

Norio Hasegawa

Takeshi Kato

Masayoshi Ishikawa

Michio Oikawa

Takuma Shibahara

Shigetoshi Sakimura

Hiroyuki Ushiba

Chikako Abe

Daisuke Hibino

Tsuyoshi Minakawa

An object of the present invention is to achieve both suppression of data amount of an image processing system that learns a collation image to be used for image identification using a discriminator and improvement of identification performance of the discriminator. In order to achieve the above object, there is proposed an image processing system including a discriminator that identifies an image using a collation image, the image processing system further including a machine learning engine that performs machine learning of collation image data required for image identification. The machine learning engine searches for a successfully identified image using an image for which identification has been failed, and adds information, obtained based on a partial image of the image for which identification has been failed and which has been selected by an input device to the successfully identified image obtained by the search to generate corrected collation image data.

Image processing system and computer program for performing image processing

The present invention relates to an image generation method for an objective for generating an image corresponding to a multi-frame image from image signals obtained by scanning a small number of frames are proposed. To achieve the above objective, there is proposed a method of performing two-dimensionally scanning on an object on a sample with a beam a plurality of times, generating a first image by integrating image signals obtained by a plurality of times of scanning at a first timing among the image signals generated based on the plurality of times of the two-dimensional scanning (S), generating a second image based on the smaller number of times of scanning than the number of times of scanning at the first timing including scanning after the first timing (S), training a learning device by using teacher data with the second image as an input and the first image as an output (S), and inputting input image signals obtained by the smaller number of times of scanning than the number of times of scanning at the first timing to the trained learning device to output an estimated image.

Image generation method, non-transitory computer-readable medium, and system

The purpose of the present invention is to provide a charged particle beam device with which it is possible to identify, to a high degree of accuracy, repeat patterns generated by a multiple exposure method such as SADP or SAQP. In order to achieve this purpose, there is proposed a charged particle beam device for: irradiating a first position on a sample with a charged particle beam to form an irradiation mark on the sample; after the formation of the irradiation mark, scanning the charged particle beam on a first visual field which includes the first position and which is larger than the irradiation mark, and thereby acquiring a first image; scanning the charged particle beam on a second visual field which includes the first position, which is larger than the irradiation mark, and which is in a different position from the first visual field, thereby acquiring a second image; and synthesizing the first image and the second image so as to overlap the irradiation marks included in the first image and the second image.

Charged particle beam device

The purpose of the present invention is to provide an exposure condition evaluation device that appropriately evaluates a wafer exposure condition or calculates an appropriate exposure condition, on the basis of information obtained from an FEM wafer, without relying on the formation state of the FEM wafer. In order to achieve the foregoing, the present invention proposes an exposure condition evaluation device which evaluates an exposure condition of a reduction projection exposure device, on the basis of the information of patterns exposed on a sample by the reduction projection exposure device, and which uses a second feature amount of a plurality of patterns formed by making exposure conditions uniform to correct a first feature amount of a plurality of patterns formed by a plurality of different exposure condition settings.

Exposure condition evaluation device

A pattern-measuring apparatus and a semiconductor-measuring system are provided which are able to obtain an evaluation result for suitably selecting processing with respect to a semiconductor device. In particular, there is proposed a pattern-measuring apparatus including an arithmetic device which compares a circuit pattern of an electronic device with a reference pattern, in which the arithmetic device classifies the circuit pattern in processing unit of the circuit pattern on the basis of a comparison of a measurement result between the circuit pattern and the reference pattern with at least two threshold values.

Pattern-measuring apparatus and semiconductor-measuring system

The purpose of the present invention is to provide a pattern measurement condition setting device which appropriately sets a measurement condition for finding out an appropriate exposure condition. To achieve the purpose, proposed is a pattern measurement condition setting device which sets a pattern measurement condition when the measurement of a pattern is executed, and is provided with an arithmetic unit which selects a pattern having a predetermined condition from pattern information for each exposure condition obtained when the exposure condition of a reduced projection exposure device is changed or pattern information for each exposure condition obtained when the exposure condition is changed by optical simulation, the arithmetic unit selecting a pattern as an object to be measured or a candidate for the object to be measured, the change of the size or shape of the pattern with respect to the change of the exposure condition satisfying a predetermined condition, and the number of patterns having the same shape as that of the pattern satisfying a predetermined condition.

Pattern measurement condition setting device and pattern measuring device

An object of the present invention is to provide a pattern-measuring apparatus and a semiconductor-measuring system which are able to obtain an evaluation result for suitably selecting processing with respect to a semiconductor device. In the present invention for attaining the object described above, there is proposed a pattern-measuring apparatus including an arithmetic device which compares a circuit pattern of an electronic device with a reference pattern, in which the arithmetic device classifies the circuit pattern in processing unit of the circuit pattern on the basis of a comparison of a measurement result between the circuit pattern and the reference pattern with at least two threshold values.

A pattern measurement device includes: a storage section storing mask edge data of a circuit pattern and image data obtained by imaging the circuit pattern; an SEM contour extracting section receiving the image data, SEM contour of the circuit pattern, and cause an exposure simulator to generate estimated SEM contour data of an estimated SEM contour on the basis of the mask edge data and SEM contour data of the extracted SEM contour; a shape classifying section receiving the mask edge data, the SEM contour data, and the estimated contour data to classify the SEM contour data and the estimated SEM contour data into a one-dimensionally shaped contour and a two-dimensionally shaped contour; and an SEM contour sampling section receiving the SEM contour data and the estimated SEM contour data to sample the SEM contour data on the basis of types of the one-dimensionally and two-dimensionally shaped contours.

Pattern measurement device and pattern measurement method

The present invention provides a pattern measuring apparatus () that: acquires the image contour of a circuit pattern formed by transferring design data; classifies the acquired image contour into shape structures; calculates normal vectors for each shape structure; maps the shape structures to the image contour; uses at least one normal direction for each shape structure to stabilize the normal directions to the image contour; and uses the normal vectors for each shape structure to determine the position of a SEM contour.

Growing community of inventors

Tokyo, Japan

Hitoshi Sugahara