Fujifilm Corporation

Fujinon Corporation

Hitoshi Shimamura

Kazuhiro Nishida

Kazuaki Takahashi

Kosuke Takasaki

A plurality of sensor packages () are fixed to a circuit assembly board () and placed on a lower mold die () of a transfer molding apparatus (). Attached inside a cavity () of an upper mold die () is a protection sheet (), which will make contact with the upper face of a cover glass () of each sensor package (). When the upper mold die () meshes with the lower mold die (), the upper face of the cover glass () is tightly covered with the protection sheet (). A plunger () is activated to fill the cavities () with sealing resin (). The upper face of the cover glass () is not stained or damaged when the peripheries of the sensor packages () are sealed.

Solid state imaging device and manufacturing method thereof

A solid-state imaging device comprises: a solid-state imaging element comprising a solid-state imaging element body; a first substrate one end face of which is bonded to and integrated with one end face of a solid-state imaging element substrate of the solid-state imaging element, the first substrate comprising on its one surface an electrode for establishing electrical contact with a bonding wire led from a pad provided on one surface of the solid-state imaging element, a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces of the solid-state imaging element substrate excluding its the one end face; and a sealing resin portion that covers a region extending from a portion including the electrode on the one surface of the first substrate to a portion including the pad on the one surface of the solid-state imaging element.

Growing community of inventors

Kurokawa-gun, Japan

Hitoshi Shimamura