Kabushiki Kaisha Toyota Jidoshokki

Hitoshi Shimadu

Tomoaki Asai

Yasuhiro Koike

Kiminori Ozaki

Hiroaki Asano

Ryou Yamauchi

Takahiro Hayakawa

Masao Miyake

Tetsuya Furuta

Shigeki Kawaguchi

Takehiko Sawada

Takahiro Suzuki

Sadanori Suzuki

Hiroki Watanabe

Tadayoshi Kachi

Harumitsu Sato

Kazunori Kondou

Tetsuya Furata

This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section.

Substrate and metal layer manufacturing method

A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.

Substrate

An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.

Wiring board and method for manufacturing wiring board

Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts () surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.

Wiring substrate and manufacturing method for wiring substrate

This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.

Wiring board

Provided is a circuit board manufacturing method capable of securing circuit patterns on a plate-like insulator while keeping the relative position between the circuit patterns, and also provided is a circuit board in which the relative position between a plurality of circuit patterns is kept. A first coil () having one turn is formed in a planar shape from a metal plate. Next, a second coil () having four turns is formed in a planar shape from a metal plate, wherein both of the ends () of the coil are linked to other adjacent regions via linking portions (). A pair of the first coil () and the second coil () are then overlapped so as to face each other through a plastic plate () in which a plurality of prepregs are stacked, after which the links by the linking portions () are disconnected.

Circuit board production method and circuit board

An electronic unit includes a double-sided substrate having an insulation substrate, a patterned first metal plate bonded on one side of the insulation substrate, and a patterned second metal plate bonded on the other side of the insulation substrate, and also includes a heat radiation member for releasing heat from the double-sided substrate. The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other of the first metal plate and the second metal plate.

Growing community of inventors

Kariya, Japan

Hitoshi Shimadu