Toto Ltd.

Hitoshi Sasaki

Yutaka Momiyama

Kosuke Yamaguchi

Yuichi Yoshii

Kengo Maehata

Tsukasa Shigezumi

Minoru Suzuki

Jumpei Uefuji

Shumpei Kondo

Tetsuro Itoyama

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a bonding layer provided between the ceramic dielectric substrate and the base plate. At least one of the following first to sixth conditions is satisfied: First condition: An elongation percentage αis not less than 120%; Second condition: A ratio αof the elongation percentage is not less than 0.60; Third condition: A bonding strength βis not less than 0.4 MPa and not more than 10 MPa; Fourth condition: A ratio βof the bonding strength is not less than 0.6 and not more than 10; Fifth condition: An elastic modulus γis not less than 0.1 MPa and not more than 10 MPa; Sixth condition: A ratio γof the elastic modulus is not less than 0.6 and not more than 30.

Electrostatic chuck

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate includes first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric substrate. The second electrode layer is provided between the first electrode layer and the first major surface. The first electrode layer includes first and second portions. The first portion is positioned more centrally of the ceramic dielectric substrate than is the second portion. The first portion includes first and second surfaces. The second portion includes third and fourth surfaces. The third surface is positioned between the first surface and the second electrode layer. An electrical resistance of the first surface is less than an average electrical resistance of the first portion.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate includes first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric substrate. The second electrode layer is provided between the first electrode layer and the first major surface. The first electrode layer includes first and second portions. The first portion is positioned more centrally of the ceramic dielectric substrate than is the second portion. The first portion includes first and second surfaces. The second portion includes third and fourth surfaces. The third surface is positioned between the first surface and the second electrode layer. An electrical resistance of the first surface is greater than an average electrical resistance of the first portion.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric, a base plate, a first electrode layer, and a second electrode layer. The ceramic dielectric substrate has a first major surface and a second major surface. The first electrode layer is provided between the first major surface and the second major surface. The second electrode layer is provided between the first electrode layer and the first major surface. The first electrode layer has a first surface and a second surface. A distance between the first surface and the first major surface is constant. A distance between the second surface and the first surface at an end portion of the first electrode layer is shorter than a distance between the second surface and the first surface at a central portion of the first electrode layer.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first electrode layer. The ceramic dielectric substrate has a first major surface and a second major surface. The first electrode layer is provided inside the ceramic dielectric substrate and connected to a high frequency power supply. The first electrode layer is provided between the first major surface and the second major surface. The first electrode layer has a first surface and a second surface. The first electrode layer includes a first region including the first surface, a second region including the second surface, and a third region positioned between the first region and the second region. A porosity of the first region is lower than a porosity of the third region.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first electrode layer. The ceramic dielectric substrate has a first major surface and a second major surface. The first electrode layer is provided inside the ceramic dielectric substrate and connected to a high frequency power supply. The first electrode layer is provided between the first major surface and the second major surface. The first electrode layer has a first surface and a second surface. A surface roughness of the second surface is larger than a surface roughness of the first surface.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate includes first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric substrate. The first electrode layer includes first and second portions. The first portion is positioned more centrally of the ceramic dielectric substrate than is the second portion. The first portion includes first and second surfaces. The second portion includes third and fourth surfaces. A distance between the third surface and the first major surface is constant. A thickness of the second portion between the third and fourth surfaces varies such that the thickness at a circumferential end portion of the second portion which is less than that at a central portion of the second portion.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate includes first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric substrate. The first electrode layer includes first and second portions. The first portion is positioned more centrally of the ceramic dielectric substrate than is the second portion. The first portion includes first and second surfaces. The second portion includes third and fourth surfaces. A distance between the fourth surface and the first major surface is constant. A thickness of the second portion between the third and fourth surfaces varies such that the thickness at a circumferential end portion of the second portion which is less than that at a central portion of the second portion.

An electrostatic chuck includes: a ceramic dielectric substrate; a base plate; and a heater plate. The heater plate includes a first and a second support plates including a metal, a heater element provided between the first and the second support plates, a first resin layer provided between the first support plate and the heater element, and a second resin layer provided between the second support plate and the heater element. A surface of the first support plate on the second support plate side includes a first region and a second region, the first region overlapping the heater element when viewed along the stacking direction, the second region not overlapping the heater element when viewed along the stacking direction. In a cross section parallel to the stacking direction, the second region protrudes toward the second support plate side compared to the first region.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing an object to be processed and a second major surface on an opposite side of the first major surface, and a base plate provided on a side of the second major surface and supporting the ceramic dielectric substrate. The base plate includes a first communicating passage passing a medium which adjusts a temperature of the object to be processed. The first communicating passage has an upper surface, a side surface, and a lower surface. A ratio of variation of a maximum height Sz in the upper surface to a height of the first communicating passage is not more than 1%.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first electrode layer. The ceramic dielectric substrate has first and second major surfaces. The first electrode layer is provided inside the ceramic dielectric substrate. The first electrode layer is connected to a high frequency power supply. The first electrode layer has a first surface at the first major surface side and a second surface at a side opposite to the first surface. The first electrode layer includes a first portion including the first surface. The first electrode layer includes a ceramic component and a metal component. A concentration of the metal component in the first portion is higher than an average concentration of the metal component in the first electrode layer.

Electrostatic chuck including ceramic dielectric substrate

An electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes first and second support plates, first and second resin layers, and a heater element. Each of the first and second resin layers is provided between the first support plate and the second support plate. The heater element includes first and second electrically conductive portions. The first electrically conductive portion is provided between the first resin layer and the second resin layer. The second electrically conductive portion is separated from the first electrically conductive portion in an in-plane direction. The first resin layer contacts the second resin layer between the first electrically conductive portion and the second electrically conductive portion.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate has first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric substrate. The second electrode layer is provided between the first electrode layer and the first major surface. The first electrode layer has a first surface at the first major surface side and a second surface at a side opposite to the first surface. The first electrode layer includes a first portion including the first surface. The first electrode layer includes a ceramic component and a metal component. A concentration of the ceramic component in the first portion is higher than an average concentration of the ceramic component in the first electrode layer.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The ceramic dielectric substrate has a surface where a processing object is placed. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes a first support plate including a metal, a second support plate including a metal, a heater element, a first resin layer, and a second resin layer. The heater element is provided between the first support plate and the second support plate. The heater element emits heat due to a current flowing. The first resin layer is provided between the first support plate and the heater element. The second resin layer is provided between the second support plate and the heater element.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, an electrode layer, a base plate, and a heater plate. The ceramic dielectric substrate has a first major surface where a processing object is placed. The electrode layer is provided in the ceramic dielectric substrate. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the base plate and the first major surface. The heater plate includes a first heater element and a second heater element. The first heater element emits heat due to a current flowing. The second heater element emits heat due to a current flowing. When viewed along a direction perpendicular to the first major surface, bends of the first heater element is more than bends of the second heater element, and the first heater element includes a portion positioned at a gap of the second heater element.

Growing community of inventors

Kitakyushu, Japan

Hitoshi Sasaki