Dipsol Chemicals Co., Ltd.

Jeol Ltd.

Hitoshi Sakurai

Satoshi Yuasa

Kazunori Ono

Akira Hashimoto

Manabu Inoue

Tomitaka Yamamoto

Katsuhide Oshima

Tadahiro Ohnuma

Shuji Igarashi

Haruo Hanagata

Hidesato Igarashi

Ayumi Saito

Keisuke Nonomura

Seiji Kishikawa

Toshiaki Murai

Mayumi Date

Osamu Mita

Tadahiro Itoh

Daichi Maekawa

AKira Hashimoto

In a charged particle beam device, a control unit performs processing for: operating a deflector based on movement information to move a visual field of a deflector from a first visual field to a second visual field; capturing the sample image with the second visual field to obtain a reference image; operating the deflector to move the visual field from the second visual field to the first visual field; operating the sample stage based on the movement information to move the visual field from the first visual field to a third visual field; capturing the sample image with the third visual field to obtain a comparison image; calculating a positional deviation amount between the reference image and the comparison image; determining whether the positional deviation amount is equal to or less than a designated positional deviation amount; and operating the sample stage based on the positional deviation amount.

Charged particle beam device and method for controlling sample stage

A transmission electron microscope includes a control unit for: acquiring an image of an objective aperture; obtaining a position of the objective aperture; obtaining an amount of deviation between an object position and the position of the objective aperture, based on the position of the objective aperture; and operating an aperture moving mechanism, based on the amount of deviation of the position of the objective aperture. The position of the objective aperture is obtained by: binarizing the image of the objective aperture by using a set threshold; obtaining an area of an aperture hole of the objective aperture from the binarized image; determining whether the area is within a predetermined range; changing the threshold when a determination is made that the area is outside the predetermined range; and obtaining a position of the objective aperture when a determination is made that the area is within the predetermined range.

Transmission electron microscope and adjustment method of objective aperture

Provided is a copper-nickel alloy electroplating apparatus which is capable of stably forming a copper-nickel plated coating on a workpiece with a uniform composition and which enables a plating bath to be used for a long period. The present invention provides a copper-nickel alloy electroplating apparatus (), comprising: a cathode chamber () in which a workpiece () is to be placed; an anode chamber (); an anode () placed in the anode chamber; an electrically conductive diaphragm () placed to separate the cathode chamber and the anode chamber from each other; a cathode chamber oxidation-reduction potential adjusting tank () for adjusting the oxidation-reduction potential of a plating liquid in the cathode chamber; an anode chamber oxidation-reduction potential adjusting tank () for adjusting the oxidation-reduction potential of a plating liquid in the anode chamber; and a power supply unit () that provides an electric current to flow between the workpiece and the anode.

Copper-nickel alloy electroplating device

The present invention provides a copper-nickel alloy electroplating bath which contains (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a conductivity imparting agent, (d) a sulfur-containing organic compound and (e) a redox potential regulator.

Copper-nickel alloy electroplating bath

The present invention provides a copper-nickel alloy electroplating bath which is characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of conductivity-imparting salts that are different from each other, (d) a compound that is selected from the group consisting of disulfide compounds, sulfur-containing amino acids and salts of these compounds, (e) a compound that is selected from the group consisting of sulfonic acid compounds, sulfimide compounds, sulfamic acid compounds, sulfone amides and salts of these compounds, and (f) a reaction product of a glycidyl ether and a polyhydric alcohol. This copper-nickel alloy electroplating bath is also characterized by having a pH of 3-8.

Copper-nickel alloy electroplating bath and plating method

An Sn--Bi alloy-plating bath comprises (i) Bi ions, (ii) Sn ions, (iii) ions of one metal selected from the group consisting of Cu, Co and Ag, and (iv) one member selected from the group consisting of carboxylic acids, lactone compounds, alkanesulfonic acids, alkanolsulfonic aicds, phenolsulfonic acids and salts thereof and is substantially free of lead ions. The bath permits the formation of an Sn--Bi alloy-plated film, does not form any plated film having impaired quality even at a temperature higher than about 100.degree. C. and does not form any whisker.

Sn-Bi alloy-plating bath and method for forming plated Sn-Bi alloy film

A Sn--Bi alloy plating bath comprises at least one compound selected from the group consisting of polyoxy monocarboxylic acids, polyoxy lactones, polycarboxylic acids and salts thereof. A plating method comprises the step of applying a Sn--Bi alloy plating film to a substrate in the foregoing plating bath. The plating bath permits the formation of a Sn--Bi alloy plating film having a bismuth content ranging from 0.1 to 75% over a wide current density range. Moreover, the plating bath never forms precipitates, does not become turbid, does not cause any change of the bath composition and is, therefore, quite stable even when it is stored over a long period of time.

Sn-Bi alloy-plating bath and plating method using the same

A tin-zinc alloy electroplating bath comprises an amphoteric surfactant, a water-soluble stannous salt, a water-soluble zinc salt and a balance of water. When the tin-zinc alloy plating bath of the present invention is used, the formed coating film comprises a uniform alloy composition even in case where the current density varies over a wide range. Therefore, the coating film having the uniform alloy composition can be formed even on the substance having a complicated shape and the chromate treatment becomes satisfactory. As a result, the effect of the coating is improved, the resultant product is stable and the productivity is improved. Thus the tin-zinc alloy coating film having a high quality can be provided.

Tin-zinc alloy electroplating bath and method for electroplating using

A chemically stable black chromate solution capable of forming an anticorrosive black chromate film on a Zn-Ni alloy plating is provided, the components being easily soluble in the solution. The black chromate solution comprises 1 to 50 g/l of hexavalent chromium; 1 to 50 g/l of sulfate ion; 0.05 to 1.0 g/l of soluble silver; 0.5 to 100 g/l of a sulfonated carboxylic acid selected from the group consisting of sulfo-aromatic carboxylic acids having 7 to 15 carbon atoms, sulfonated aliphatic dicarboxylic acids having 3 to 10 carbon atoms and salts thereof; and a balance of water, the solution having a pH of 0.5 to 2.5.

Black chromate solution

The invention provides an electroplating bath for forming a zinc-nickel alloy coating consisting essentially of water, about 1 to 70 grams/liter of zinc, about 0.6 to 118 grams per liter of nickel, at least one compound from the group consisting of (i) aliphatic amines in an amount not more than 16 grams/liter, (ii) polymers of aliphatic amines in an amount not more than about 20 grams per liter and (iii) a compound selected from the group consisting of hydroxyaliphatic carboxylic acids and salts thereof in an amount from 0 to 2 mols/liter, said bath having a pH of more than 11. The invention also provides an electroplating method for forming a chromate coating on a zinc-nickel alloy coating electrolytically deposited from the electroplating bath defined in the preceding sentence on electrically conductive metalics matrix material, and forming a chromate coating on the zinc-nickel alloy coating by means of a chromate treatment.

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Tokyo, Japan

Hitoshi Sakurai