Sony Corporation

Nec Corporation

Creative Coatings Co., Ltd.

Tokyo Electronics Industry Co., Ltd.

Hitoshi Sakamoto

Minoru Yoshikawa

Arihiro Matsunaga

Kenichi Inaba

Masaki Chiba

Takeya Hashiguchi

Akira Shoujiguchi

Eiji Sato

Yoshiaki Wakisaka

Kazuyuki Mikubo

Takayuki Okafuji

Mahiro Hachiya

Katsuichi Tachi

Ichiro Ninomiya

Takeo Ohba

Daijiro Okihara

Kazuhiro Takano

Chenpin Hsu

Katsuhiko Nagakura

Ryuichi Yamayoshi

Toshiaki Iwata

An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

Electronic component manufacturing method and apparatus

A method for forming a coating film on a powder includes: a dispersion step of setting a container having contained the powder P in a main body of a dispersion device, and dispersing the powder in the container by the main body of the dispersion device; and an ALD step for forming the coating film on a surface of the powder, by setting the container having been removed from the main body of the dispersion device in a main body of an ALD apparatus in such a state that gas can be introduced and be exhausted, introducing a gas for performing an ALD cycle into the container, filling the container with the gas, and then exhausting the gas.

Method for forming coating film on powder, container for use in formation of coating film on powder, and ALP apparatus

An electronic component manufacturing apparatus has a holding member for holding an electronic component body, a surface plate, a moving unit that causes the holding member and the surface plate to relatively move, and a control unit that controls the moving unit. The control unit causes the moving unit to simultaneously perform a distance changing movement for changing, by shortening or extending, the distance between an end face of each electronic component body and a surface of the surface plate, and a position changing movement for changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction in which the two-dimensional position moves in parallel with the surface of the surface plate successively varies (for example, along a circular path).

Electronic component manufacturing apparatus

A cooler grows in size and its structure becomes complicated in a phase-change cooler if it is intended to cool a plurality of heating elements; therefore, a phase-change cooler according to an exemplary aspect of the present invention includes a heat-conducting board configured to be thermally connected to a cooling object; heat receiving means for storing a refrigerant and receiving heat of the cooling object through the heat-conducting board; radiation means for radiating heat, condensing and devolatilizing a vapor-phase refrigerant arising from vaporization of the refrigerant in the heat receiving means; and connection means for connecting the heat receiving means and the radiation means.

Phase-change cooler and phase-change cooling method

A cooling deviceincludes a first heat receiving unit, a second heat receiving unit, a first heat dissipating unit, and a second heat dissipating unit. The first heat dissipating unitand the second heat dissipating unithave a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surfacethat is a principal surface having a flat plate shape in the first heat dissipating unitand a second principal surfacethat is a principal surface having a flat plate shape in the second heat dissipating unitare arranged so as to face to each other. As a result, the size of the cooling devicecan be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.

Cooling device and electronic device

An electronic boardhas a heat generating componentmounted on it. An enclosurehouses the electronic board. A heat transport unitis coupled to the enclosureand transports heat generated by the heat generating componentto the outside. A heat receiving unitis provided in a heat transport unitA. The heat receiving unitreceives heat generated by the heat generating component. A heat dissipating unitis provided in the heat transport unitin such a manner that a portion of the heat dissipating unitis exposed to outside air, and is coupled to the heat receiving unit. The heat dissipating unitdissipates heat received by the heat receiving unitto the outside. A guide duct unitis formed into a tube interconnecting the heat generating componentand the heat receiving unitin order to release heat of the heat generating componentto the heat receiving unit. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

Electronic device and cooling system

In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

Cooling apparatus, heat receiving section and boiling section used therein, and method of manufacturing the same

A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer.

Cooling system for electronic device storing apparatus and cooling system for electronic device storing building

A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.

Phase change cooler and electronic equipment provided with same

A cooling structure is provided which includes: an evaporation chamber defined by a base plate having a boiling surface, a ceiling plate and a side wall; a plurality of plate-shaped fins arranged in parallel on the boiling surface, defining a plurality of coolant passages in the evaporation chamber, a liquid phase coolant flows through the coolant passages in one direction from one end portion thereof toward another end portion; a liquid return port formed in the side wall facing the one end portion of coolant passages; and a vapor port formed in the ceiling plate facing the other end portion of coolant passages, wherein space is formed between the ceiling plate and an upper end portion of the plurality of plate-shaped fins, the space expanding gradually from a liquid return port side of the side wall toward the vapor port.

Cooling structure, electronic device using same, and cooling method

A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

Cooling apparatus and cooling system

It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Connecting structure of cooling device, cooling device, and method for connecting cooling device

A vapor phase cooling apparatus () includes: a housing () including a heat receiver () configured to receive heat generated by an electronic component () that is a heat generating source, the electronic component () being connected to a vertical outer surface on the +Z side of the housing, the housing including an internal space for enclosing refrigerant; and a first heat sink () and a second heat sink () that are disposed on the +Y side and the &#x2212;Y side from the electronic component () and that dissipate heat to the outside. Both ends of the first heat sink () and the second heat sink () in X direction extend further along the surface on the +Z side than both ends of the heat receiver () in X direction.

Vapor phase cooling apparatus and electronic equipment using same

An electronic substrate has a tabular base material which can install a heater element and a cooling structure that cools the heater element. The electronic substrate can be plugged in/out in a case in the direction which is almost parallel to the face of the base material. The cooling structure has a first heat radiation part with a hollow shape and a heat transfer part. The first heat radiation part radiates the generated heat of a heater element installed in the base material. A heat transfer part transfers the generated heat to the first heat radiation part. The first heat radiation part has a first joint surface formed along a face which is almost vertical to the insert and removal direction of the base material. The first heat radiation part is connected to a second radiation part set up in the case thermally through the first joint surface.

Growing community of inventors

Tokyo, Japan

Hitoshi Sakamoto