Dai Nippon Printing Co., Ltd.

Yazaki Corporation

Canon Kabushiki Kaisha

Fuji Photo Film Company, Limited

Fujitsu Corporation

Honda Giken Kogyo Kabushiki Kaisha

Fujitsu Semiconductor Limited

Yokogawa Electric Corporation

Kabushiki Kaisha Toshiba

Sony Corporation

Nec Corporation

Tdk Corporation

Nissan Motor Company Limited

Sony Semiconductor Solutions Corporation

Adeka Corporation

Hitoshi Saito

Toru Maeda

Jumpei J Kanto

Kazuhiro Sugawara

Shino Takao

Hitoshi Sakai

Masayuki M Nakamura

Hiroshi H Eguchi

Ryohei Takiguchi

Hiroshi Miyakawa

Yoshitaka Tamura

Masanori Momose

Takayoshi Endo

Akira Matsui

Mineo M Yamauchi

Makoto Kobayashi

Shinichiro Kohri

Seiichi Shimamura

Fumitomo Takano

Jun Hasegawa

Satoshi Imai

Mamoru Tomita

Toru Fujino

Masanori Torii

Naomi Nakamura

Yasushi Morimoto

Kazuto Ohtaka

Osamu Sugiyama

Hideo H Fujimura

Junichi Hiroi

Shinji Kometani

Hiroshi Ochi

Takehiro Yoshida

Masamichi Sato

Katsuyuki Oshima

Makoto Suzuki

Masaki M Kutsukake

Tatsuya Kita

Sakai Yagi

Yasuyuki Suzuki

Kouichi Nagai

Kimihiro Abe

Masanori Akada

Toshio Abe

Kazunobu Imoto

Takeshi Ueno

Hideaki Sato

Yoshinori Nakamura

Hisashi Hanazaki

Mikio Asajima

Seiichi Takahashi

Kaoru Saigoh

Koji Harada

Kenji Yamakawa

Masayasu Yamazaki

Satoru Kawai

Yoshihiko Tamura

Mitsunori Takase

Susumu Kobayashi

Koji Yamauchi

Koji Takahashi

Akio Yamada

Hiroshi Yamamoto

Takashi Matsumoto

Hiroshi Yamada

Wensheng Wang

Yasuhiro Tanaka

Kazuhiro Asai

Kenji Yamaguchi

Kenichi Utsumi

Yasushi Sato

Takao Miyazaki

Hideki Ohsumi

Naoya Sashida

Shigeo Mori

Takahiro Yoneda

Yutaka Soda

Tetsuya Takatori

Shigenori Oosaka

Nobuo Katsuma

Kenichiro Suto

Michiyuki Kono

Makoto Takahashi

Toshinori Yamamoto

Yasuo Nagashima

Kozo Odamura

Hirotaka Okamoto

Tomoyoshi Nishimura

Masato Yamaji

Etsuo Tobita

Naoki Sugawara

Akira Morisawa

Takahisa Miyamoto

Hideaki Matsumura

Naoshi Kawamoto

Toshiki Ono

Fuyuki Inui

Kazutoshi Izumi

Mitsuru Nakano

An optical fiber ribbon manufacturing device comprising: a tape diefor coating a plurality of single-core coated optical fiberswith a photocurable resin; a split diefor forming a split portion in the photocurable resin present between the single-core coated optical fibers; and a light irradiation devicefor irradiating the photocurable resin with light to cure the photocurable resin, wherein both the tape dieand the split dieare temperature-controlled or only the split dieis temperature-controlled, a temperature of the tape dieis higher than a temperature of the split die, and the temperature of the split dieis lower than the temperature of the tape die

Device and method for manufacturing optical fiber ribbon

Provided are an information processing apparatus and an information processing method, an imaging apparatus, a mobile device, and a computer program that performs processing for controlling exposure of an in-vehicle camera. The information processing apparatus includes: a recognition unit that recognizes an image after an output signal of an image sensor is processed by a processing unit; and a control unit that controls at least one of imaging operation of the image sensor or processing operation in the processing unit on the basis of a recognition result of the recognition unit. The image sensor is mounted on a vehicle and used, and the recognition unit image-recognizes at least a surrounding vehicle or a road surface. Then, the control unit controls detection or development processing of the region of the surrounding vehicle or the road surface in the image.

Information processing apparatus and information processing method, imaging apparatus, mobile device, and computer program

A valve opening and closing system includes: a site/center switching manual valve; a manual valve for opening and closing operation; an opening/closing switching electric driving valve that opens and closes a manual valve and that nullifies the manual valve for opening and closing operation; a center wireless transmitter that accepts and transmits an operation instruction including an opening and closing operation instruction and a forced closing operation instruction; and a site wireless transmitter, and a contact signal converter, the site side valve control device transmits both of the opening and closing operation instruction and the forced closing operation instruction to the contact signal converter when the site/center switching manual valve is switched to the center control side, and interrupts the opening and closing operation instruction and transmits the forced closing operation instruction to the contact signal converter when the site/center switching manual valve is switched to on site.

Valve opening and closing system and valve control device

To wirelessly transmit, from intrinsically-safe type equipment placed in a hazardous area, a loop electrical signal measurement value obtained from flameproof type equipment. A flameproof input intrinsically-safe output transmitter covered with a flameproof enclosure includes an intrinsically-safe-side terminal connected to an intrinsically-safe built-in battery type wireless device, a flameproof-side electrical signal terminal configured to input a loop electrical signal, and an electrical input signal transmitter circuit configured to measure the loop electrical signal and transmit a signal in accordance with a measurement result to the intrinsically-safe-side terminal.

Flameproof input intrinsically-safe output transmitter

An interface module according to one aspect of the invention includes an interface and a local communication device. The interface, which is connected to a field device, receives a first wireless signal from the field device. The local communication device wirelessly transmits the first signal to a wireless module by first local communications. The local communication device receives, from the wireless module by second local communications, a second signal destined for the field device that is wirelessly transmitted from an external device and wirelessly received by the wireless device. The interface device outputs the second signal to the field device.

Wireless device and interface module

The purpose of the present invention is to enable use of a solenoid-type electromagnetic valve () in a valve driving device () that performs wireless communication. A contact signal converter () that converts an on-off contact signal to a control signal for operating a solenoid-type electromagnetic valve () comprises an explosion protection barrier () which restricts the current of the control signal to be no more than a maximum current established for safety regarding solenoid-type electromagnetic valves (), and a group of batteries (), the number of which can ensure a voltage at which the voltage supplied via the explosion protection barrier () surpasses the operating voltage of the solenoid-type electromagnetic valve ().

Contact signal converter

It is to realize a valve remote control apparatus capable of driving and controlling, with wireless signals, an air motor configuring an automatic switch to be attached to a manual valve. A valve remote control apparatus is configured to mechanically connect, to a manual operating portionof an existing manual valve, an output shaftof an air motorusing an air pressure as a drive source, and to remotely control the manual value. The valve remote control apparatus includes a solenoid valve (operating valve) operated by an operation signal transmitted and received wirelessly between a contact information terminal portionand a contact information operating portion. The air pressure for driving and rotating the air motoris supplied via the solenoid valve (operating valve).

Valve remote control apparatus

A semiconductor device includes: a semiconductor substrate; a base above the semiconductor substrate; a first conductive plug in the base; a memory cell region in the base; and a logic circuit region connected to the memory cell region, the logic circuit including a first capacitor. The first capacitor includes: a first bottom electrode, a part of a lower surface of the first bottom electrode being in contact with the first conductive plug; a first insulating film on the first bottom electrode; and a first top electrode on the first insulating film. The first top electrode is spaced apart from the first conductive plug in planar view.

Semiconductor device and method of manufacturing the same

An embodiment of a compound semiconductor device includes: a first lower electrode; a first insulating film over the first lower electrode; a first upper electrode over the first insulating film; a second lower electrode separate from the first lower electrode; a second insulating film over the second lower electrode; a third insulating film over the second insulating film; and a second upper electrode over on the third insulating film. A thickness of the first insulating film is substantially the same as a thickness of the third insulating film, a contour of the third insulating film in planar view is outside a contour of the second insulating film in planar view, and a contour of the second upper electrode in planar view is inside the contour of the second insulating film in planar view.

A semiconductor device includes a semiconductor substrate including an element region, an inner sealing and an outer sealing which are formed on the element region and have a first opening part and a second opening part, respectively, a multilayer interconnection structure which is formed on the substrate and stacks multiple inter-layer insulation films each including a wiring layer, a moisture resistant film formed between a first inter-layer insulation film and a second inter-layer insulation film which are included in the multilayer interconnection structure, a first portion which extended from a first side of the moisture resistant film and passes the first opening part, a second portion which extended from a second side of the moisture resistant film and passes through the second opening part, and a wiring pattern including a via plug which penetrates the moisture resistant film and connects the first portion and the second portion.

Semiconductor device and test method

A method of manufacturing a low-phosphorus whey, the method including subjecting a raw whey liquid to a demineralization treatment using a nanofiltration method to obtain a low-chloride whey liquid in which the chloride content has been reduced to not more than 30 mmol per 100 g of solids, and passing the low-chloride whey liquid through an ion exchange resin to obtain an ion-exchanged whey liquid having a reduced phosphorus content, wherein the ion exchange resin is composed of an anion exchange resin, and at least an anion exchange resin in chloride form is used as the anion exchange resin. The method of manufacturing a low-phosphorus whey can reduce the phosphorus content within the whey while suppressing reduction in the calcium and magnesium content.

Method for manufacturing low-phosphorus whey

An insulation film () having a gradual inclination of a surface is formed by a high density plasma CVD method, an atmospheric pressure CVD method or the like, after a ferroelectric capacitor () is formed. Thereafter, an alumina film () is formed on the insulation film (). According to the method, low coverage of the alumina film () does not become a problem, and the ferroelectric capacitor () is reliably protected.

Semiconductor device and manufacturing method thereof

After a ferroelectric capacitor is formed, an Al wiring (conductive pad) connected to the ferroelectric capacitor is formed. Then, a silicon oxide film and a silicon nitride film are formed around the Al wiring. Thereafter, as a penetration inhibiting film which inhibits penetration of moisture into the silicon oxide film, an AlOfilm is formed.

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

A coreless thermal transfer recording web rollis formed by rolling a thermal transfer recording weba in a roll. An inner end partof the thermal transfer recording weba of the thermal transfer recording web rollhas a taba formed at a substantially middle of the inner end partand sticking partsb formed on the opposite sides of the taba, respectively. Pseudoadhesive double-coated tapesare attached to the sticking partsb, respectively. The pseudoadhesive double-coated tapes become tack-free after the sticking partsb have been separated from the innermost layer of the thermal transfer recording weba of the thermal transfer recording web roll

Thermal transfer recording web roll

Growing community of inventors

Kawasaki, Japan

Hitoshi Saito