Hitachi Chemical Company, Ltd.

Hitoshi Onozeki

Takahiro Tanabe

Shin Takanezawa

Nobuyuki Ogawa

Kenji Takai

Norio Moriike

Toshihisa Kumakura

Takako Ejiri

Kiyoshi Saitou

Provided are a metal foil single-clad two-ply laminate which comprises two pairs of structures each comprising one prepreg or a laminate of two or more prepregs cladded with a metal foil on one surface thereof, wherein the two pairs of structures are laminated on each other through thermal compression via a release material put therebetween so that each prepreg faces inward, and wherein the release material is a film of a resin material or the like and its thickness is from 10 to 200 &#x3bc;m, and the thermal shrinkage of the release material at the temperature of the thermal compression treatment is at most 1.5%; and a method for producing the laminate. Also disclosed are a single-sided printed wiring board and its production method using the metal foil single-clad two-ply laminate.

Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board

Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 &#x3bc;m on a metal whose surface has a ten-point average roughness Rz of 2.0 &#x3bc;m or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

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Ibaraki, Japan

Hitoshi Onozeki