Showa Denko Materials Co., Ltd.

Resonac Corporation

Hitoshi Onozeki

Hiroshi Takahashi

Hiroshi Shimizu

Naoya Suzuki

Kumpei Yamada

Daisuke Fujimoto

Shizu Fukuzumi

Toshihisa Nonaka

Tsubasa Inoue

Katsuji Yamagishi

Yuta Koseki

Provided is a semiconductor element mounting structure, including: a semiconductor element including an element electrode, and a substrate including a substrate electrode that is provided on a surface facing the semiconductor element at a position facing the element electrode, the semiconductor element and the substrate being connected via the element electrode and the substrate electrode, in which: one of the element electrode or the substrate electrode is a first protruding electrode including a solder layer at a tip portion thereof, the other of the element electrode or the substrate electrode is a first electrode pad including one or more metal protrusions on a surface thereof, the one or more metal protrusions of the first electrode pad extend into the solder layer of the first protruding electrode, and a bottom area of each of the one or more metal protrusions of the first electrode pad is 70% or less with respect to an area of the first electrode pad, or 75% or less with respect to a maximum cross-sectional area of the solder layer of the first protruding electrode.

Semiconductor element mounting structure, and combination of semiconductor element and substrate

Disclosed is a production method of a multi-layered printed wiring board, including the following steps 1 to 3:

Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board

Growing community of inventors

Tokyo, Japan

Hitoshi Onozeki