Hitachi, Ltd.

Other

Renesas Technology Corp.

Hitoshi Odashima

Hideaki Sasaki

Shinichi Kazui

Mitsugu Shirai

Makoto Matsuoka

Yutaka Hashimoto

Keiji Fujikawa

Kazuyuki Futagi

Isamu Takaoka

Mitsuhiro Suzuki

Kenji Morita

Chuichi Miyazaki

Hiroshi Hasegawa

Takashi Wada

Hiroshi Honma

Kosuke Inoue

Takamichi Suzuki

Michiharu Honda

Shigeo Shiono

Hiromichi Hiramatsu

Hideyuki Fukasawa

Kuniaki Hirayama

Takeshi Kawana

Toshio Ohji

Yoshitatsu Naito

Osamu Isshiki

Tatsuya Yoneda

Tsuyoshi Yamaguchi

Masayuki Kawaharata

Toshimitsu Nakagawa

Tetsuo Murakami

Katsuhiro Iwashita

Noriyuki Ooroku

Katuhisa Tanaka

Asahi Tsuchiya

Kouji Sajiki

Kazuo Shirase

Toru Mita

Syoji Nakakuki

Izumi Hata

To improve the reliability and yield of a thin-type semiconductor device as used for a stack-type flash memory, the semiconductor device is manufactured by upheaving each of semiconductor chips (semiconductor devices) obtained by dicing a semiconductor wafer on an adhesive sheet from a backside via the adhesive sheet using an upthrow jig to which ultrasonic vibration is applied so as not to break through the adhesive sheet, and by picking up each semiconductor chip.

Semiconductor device and its manufacturing method

A semiconductor device mounting method and system and an IC card fabricating method which can fabricate high quality products by dicing a thin semiconductor wafer, in a state where it is adhered to an adhesive sheet, into thin semiconductor devices, peeling the group of diced thin semiconductor devices from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, conveying the group of peeled semiconductor devices on a unit basis in serial order, and mounting them onto a mounting board.

Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card

In an apparatus for separating semiconductor chips, a semiconductor wafer stuck to an adhesive sheet with its silicon mirror surface facing downwards is sucked as a whole through its circuit surface side by means of a sucker plate capable of sucking the whole of wafer. In order to separate the sheet from a frame fixing the sheet while the sheet being sucked, the sheet is cut by a cutter edge so as to be separated from the frame. To separate the sheet from the wafer, the wafer top surface is guided by a guide plate having a tip angle of 15&deg; and by causing the sheet to profile the tip of the guide plate, the sheet is peeled off in a direction making an angle of 45&deg; to the dicing direction on the wafer.

Method and apparatus for separating semiconductor chips

Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

Thin electronic circuit component and method and apparatus for producing the same

There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.

Bump forming method and apparatus therefor

A surface of a wafer (semiconductor substrate) is subjected to grinding by rotating it and bringing it into contact with a rotating grinding wheel. The grinding wheel is rotated in a first direction at a rotating speed N The wafer is rotated in a second direction which is opposite to the first direction at a rotating speed N wherein a value of N N is in the range of 0.006 to 0.025. The wafer is then carried from the grinding process to a dicing process while being maintained in a horizontal position by using a wafer handling jig to prevent the breakage of the wafer. A flash etching process may also be used at the end of the grinding process.

Grinding method, semiconductor device and method of manufacturing semiconductor device

The present invention is to define an enclosed space by covering a holder which can hold numerous minute particles, and introduce a fluid into the enclosed space to stir up the numerous minute particles within the enclosed space with a turbulent flow of the fluid so that the minute particles are placed in and held by the holder After stirring up and loading the minute particles in the holder, the fluid is introduced into the enclosed space again to recover the remaining minute particles which have not been held by the holder. The number of minute particles required for one cycle of the loading operation are taken out by moving a particle push-up shaft vertically, having a recess at the distal end thereof, within a stocker which stores a large number of minute particles, and then delivered to the enclosed space with the fluid.

Minute particle loading method and apparatus

A coil mounting method and apparatus is disclosed, for example, for mounting coils to the inner periphery of a cylindrical core in assembling a cylindrical rotary transformer of a VTR cylinder. A wire is wound round the outer periphery of a coil holding jig that is capable of opening and closing in a radial direction. After the coil is formed, the coil holding jig is inserted into a cylindrical article and opened radially to have the coil fitted in a coil groove formed in the inner periphery of the cylindrical article. The mounting of the coil to the inner periphery of a cylindrical article can be done in a short time through a reduced number of steps.

Method and apparatus for mounting coils inside a hollow cylindrical

An apparatus for connecting wiring patterns on a wiring board and leads of a parts to be mounted on the wiring board, via the solder provided between the leads and the patterns. The parts-connecting apparatus enables, especially, circuit elements of a high degree of, to be connected automatically with high reliability and accuracy by using solder through the steps of setting the wiring board in a predetermined position while pressing a surface thereof so as to remove the warp from the wiring board, fastening the leads of the part to the wiring patterns by a magnet provided on the lower surface of the wiring board, and heating the solder provided on the portions of the leads which are fastened to the wiring patterns.

Parts-connecting apparatus using solder

Growing community of inventors

Yokohama, Japan

Hitoshi Odashima