Fujitsu Corporation

Fuji Furukawa Engineering & Construction Co., Ltd

Hitoshi Nori

Shunichi Kikuchi

Minoru Hirano

Hideki Kimura

Junichi Ishimine

Yoichi Sato

Naoki Shinjo

Kiyotaka Seyama

Akihiro Yasuo

Katsuhiko Nakata

Mitsuo Hayashi

Yoshihisa Iwakiri

Yoshihiro Kusano

Kengo Ueda

Tomoaki Haneda

Kouji Kuroda

Mika Tokumitsu

Kenji Tosaka

Masumi Suzuki

Jie Wei

Hideaki Yoshimura

Takashi Kanda

Tsuyoshi So

Akihiko Fujisaki

Masahiro Miyo

Makoto Sumiyoshi

Naoki Yasuda

To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Cooling system for information device

A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board.

Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board

The cooling system allows the liquid coolant discharged from the pump to flow into the evaporation chamber. The liquid coolant passes through the atomizer. Minute droplets of the atomized coolant is discharged from the atomizer into the evaporation chamber. The minute droplets serve to form a uniform thin liquid film over the surface of the fin. Heat conducting from a target heat generating object to the fin promotes the evaporation of the liquid coolant over the surface of the fin, for example. The coolant absorbs a large amount of heat from the fin based on the evaporation. The target heat generating object can thus efficiently be cooled.

High efficiency cooling system and heat absorbing unit

A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.

Heat sink structure for cooling a substrate and an electronic apparatus

A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

Semiconductor element cooling apparatus

A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.

Multi-chip module having a multi-layer circuit board with insulating

Growing community of inventors

Kawasaki, Japan

Hitoshi Nori