Kaneka Corporation

Kanegafuchi Kagaku Kogyo Kabushiki Kaisha

Kanegafuchi Kagaku Kogyo K.k.

Hitoshi Nojiri

Shoji Hara

Koji Okada

Hirosaku Nagano

Hiroyuki Furutani

Kohji Okada

Yoshifumi Okamoto

Katsunori Yabuta

Tsuneo Yamamoto

Junya Ida

Koichiro Tanaka

Hiroyuki Tsuji

Hideki Kawai

Masaru Nishinaka

Takashi Itoh

Junji Takase

Yoshio Sakata

Yoshihide Ohnari

Koji Sezaki

Kazuhisa Danno

Naoki Hase

Takeshi Kikuchi

Hiroshi Ito

Yoshihide Oonari

Shinji Inoue

Tomohiro Ohzuru

Masaro Kidoh

Katuhiro Kitai

A laminate comprising a polyimide and a conductor layer, which is obtained by forming at least one conductor layer directly on the surface of a thermoplastic polyimide, is thermally fused by pressurizing and heating to thereby enhance the adhesion strength between the thermoplastic polyimide and the conductor layer. Thus, a laminate having an excellent adhesion strength between a conductor layer and a polyimide film can be obtained without performing any surface roughening treatment or using any adhesive metal layer.

Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the same

An object of present invention is to provide a diamine and an acid dianhydride having photoreactivity and thermoreactivity and a polyimide composition containing the diamine and the acid dianhydride as monomer components, and specifically to synthesize a diamine and an acid dianhydride having a photoreactive and thermoreactive group containing a double bond or triple bond such as cinnamic acid, chalcone, benzalacetophenone, stilbene, coumarin, pyrone, allyl, propargyl, and acetylene or a derivative skeleton thereof so as to exhibit photoreactivity and thermoreactivity specific to the reactive group, thereby providing a polyimide composition containing the diamine and the acid dianhydride.

Diamine novel acid dianhydride and novel polyimide composition formed therefrom

A multi-layered endless belt having an arbitrary layer thickness by the thickness of the film and the winding number, a medium conveying belt using the same, and a method and apparatus by which these can be stably produced without various residues in the production process and can be produced with a high general-purpose properties and at a low cost. There are provided a multi-layered endless belt made by winding and heat-welding a polymer material film and a production method thereof, and further a production method of medium conveying belts of various forms fundamentally having a construction in which an electrode pattern and a protective film are laminated thereon, and a novel production method and molding apparatus for molding the multi-layered endless belt by heat-pressing a wound tubular body.

Multi-layered endless belt, medium conveying belt made of the same, production method thereof, and forming apparatus thereof

The present invention provides a method for easily producing a high-molecular weight polyimide resin at high yield by drying and heating a mixture mixed by material monomers of polyimide.

Process for producing polyimide resin

The present invention provides a novel diamine and a novel acid anhydride which are applicable for a polyimide and includes a cinnamoyl group or a derived cinnamoyl group. The novel diamines and acid anhydrides have photo-reactivity and heat-reactivity inherent to the cinnamoyl group.

Diamine and acid anhydride

Acid anhydrides

An object of the present invention is to provide an epoxy modified polyimide, which is a resin capable of treating at a low processing temperature and having an excellent heat resistance; photosensitive composition; coverlay film, which is excellent in electrical insulation property, heat resistance for soldering, film-formability, flexibility, and chemical resistance; solder resist; and printed wiring board. The epoxy modified polyimide is obtained by synthesizing polyimide having a hydroxy group or carboxy group and subsequently reacting the polyimide with an epoxy compound. The photosensitive composition is obtained by adding a photoreaction initiator or the like to the epoxy modified polyimide. The coverlay film and the solder resist can be formed from the photosensitive composition. The printed wiring board is produced using the coverlay film and the solder resist.

Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide

Polyimide compositions and novel acid dianhydrides to be used therein

A polyimide film, which is produced from polyamide acid prepared through the reaction of p-phenylenebis(trimellitic acid monoester anhydride), oxydiphthalic acid dianhydride, p-phenylenediamine, and 4,4&prime;-diaminodiphenylether in an organic solvent, and which has a high elastic modulus, a high elongation, a low coefficient of linear expansion which is not quite different from that of copper, and a low coefficient of hygroscopic expansion.

Polyimide film and process for producing the same

A polyimide represented by the following general formula (1);

Polyimide composition and process for producing the same

The present invention provides a novel polyimide composition which includes a cinnamoyl group or a derived cinnamoyl group and has photo-reactivity and heat-reactivity inherent to the cinnamoyl group. Further, a novel diamine and an acid dianhydride according to the present invention are materials mainly used for preparing a novel polyimide composition having the cinnamoyl group or the derived cinnamoyl group in a main chain or a side chain.

Polyimide compositions

Thermally fusible adhesive copolymer, articles made therefrom, and

An epoxy-terminated polyamide having the following structure: ##STR1## where each of R.sub.1, R.sub.2, and R.sub.3 is a divalent organic group, and each of n and m is a natural number, and an adhesive containing the above epoxy-terminated polyamide, an epoxy resin and a curing agent. The epoxy-terminate polyamide is well compatible with epoxy resins and an adhesive containing the same is excellent in adhesiveness and thermal resistance.

Epoxy-terminated polyamide, adhesive made therefrom and methods for

The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular. The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 respectively designate quadrivalent organic radical, wherein, 1, m, and n, respectively designate positive integer 0 to 1 or more than 1, wherein the sum of 1 and m aggregates 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

Thermoplastic polyimide, polyamide acid, and thermally fusible laminated

Growing community of inventors

Shiga, Japan

Hitoshi Nojiri