Seiko Instruments Inc

Subaru Corporation

Nihon Kohden Corporation

Other

Agency Industrial Science

Hitoshi Niwa

Yoshikazu Kojima

Hiroaki Takasu

Kunihiro Takahashi

Nobuyoshi Matsuyama

Tsuneo Yamazaki

Tomoyuki Yoshino

Yutaka Hayashi

Masaaki Kamiya

Harutoshi Terasawa

Teru Hayashi

Yomoyuki Yoshino

A vehicle includes a level difference detector and a running controller. The level difference detector is configured to detect a level difference. The running controller is configured to perform in parallel level-difference override suppression control to suppress erroneous start for override of the level difference and level-difference override support control to support override of the level difference.

Vehicle system for detecting level differences and implementing override control mechanisms

A rectifying device includes an air flow generator. The air flow generator is disposed at an exterior member of a vehicle. The exterior member is adjacent to a detector of a sensor that is disposed such that at least a portion of a detection range of the detector includes a rear region behind a plane in a traveling direction of the vehicle. The plane is parallel to a width direction and a vertical direction of the vehicle. The air flow generator is configured to generate an air flow that separates, from the detector of the sensor, travelling wind that accompanies travel of the vehicle. The air flow generator includes a plasma actuator that includes at least a pair of electrodes and a power source that is configured to apply an alternating current voltage to the electrodes.

Rectifying device

A pinch device for detecting a biomedical signal which pinches a measuring site of a living body in order to detect a biomedical signal, includes a pair of body members which are opposed to each other, said body members being rotatably coupled to each other via a shaft portion, a movable member mounted to a tip end of one of said paired body members so as to be rotatable, and said movable member having a contact face opposed to another contact face which is formed at a tip end of another one of said paired body members, and a spring member urging said contact face of said movable member and said other contact face of said body member which is opposed to said movable member, in an approaching direction.

Pinch device for detecting a biomedical signal

A process for manufacturing a light valve device comprises forming a transparent insulating thin film layer on a surface of a semiconductor substrate, and forming a single crystal semiconductor thin film on a surface of the transparent insulating thin film layer. A portion of the single crystal semiconductor thin film is then removed and at least one pixel electrode is formed on the transparent insulating thin film layer at a region where the single crystal semiconductor thin film has been removed. A driving unit is then formed in the single crystal semiconductor thin film. Thereafter, a carrier substrate is laminated using an adhesive on the surface of the semiconductor substrate at a region corresponding to the pixel electrode and the driving unit. The semiconductor substrate is then removed to expose a surface of the transparent insulating thin film layer and through-holes and a metal film are formed on the exposed surface thereof. Thereafter, the metal film is removed to form a light shielding layer for covering at least a portion of a region of the transparent insulating thin film layer occupied by the driving unit and to form an electrode pad for connection to the driving unit through the through-holes. A substrate is then arranged opposite to the transparent insulating thin film to define a gap therebetween, and an electrooptical material is disposed in the gap.

Process for manufacturing light valve device using semiconductive

A process for manufacturing a semiconductor device comprises forming an SOI substrate by depositing an insulating film of silicon dioxide on a surface of a temporary silicon substrate, thermally bonding a semiconductor substrate of single crystal silicon on a surface of the insulating film, and polishing the semiconductor substrate to form a single crystal semiconductor thin film. A semiconductor integrated circuit is then formed in the single crystal semiconductor thin film. Thereafter, a support substrate is fixedly adhered in face-to-face relation to a surface of the semiconductor integrated circuit opposite to the temporary substrate. The temporary substrate is then removed to expose a surface of the insulating film. The exposed surface of the insulating film is then subjected to a treatment including at least forming an electrode.

Method of making light valve device using semiconductive composite

A semiconductor wafer is comprised of a transparent layer interposed between a thin silicon layer and a thick silicon layer. Silicon islands are formed from the thin silicon layer on the transparent layer. Device elements are formed in the silicon islands. Thereafter, the thick silicon layer which is a support layer is etched away to form a transparent region on the wafer. The wafer is constructed to avoid elimination or destruction of the transparent layer during the course of formation of the silicon islands and during the course of etching of the rear thick silicon plate. The transparent layer is comprised of a silicon nitride film or a silicon carbide film. Alternatively, the transparent layer is comprised of a silicon oxide film covered by a silicon nitride film or a silicon carbide film on one or both of the upper and lower faces of the silicon oxide film.

Method of making semiconductor device with multiple transparent layers

Herein disclosed are a semiconductor device having a double-side wiring structure, in which a single crystal semiconductor thin film formed integrally with transistor elements is laminated on an insulating thin film and is formed with through holes and in which the insulating thin film is formed on its back with electrodes and a shielding film, and a light valve device using the semiconductor device. Over the single crystal semiconductor thin film, there are formed switching elements of transistors, pixel electrodes connected electrically with the switching elements, and drive circuits for scanning and driving the switching elements. Also disclosed is a miniature highly dense light valve device. In this light valve device, an electrooptical substance is arranged between a multi-layer substrate, which is formed with electrodes and a shielding film at the opposed side of the insulating film to the side formed with the grouped elements through the insulating film, and a transparent opposite substrate, so that the optical transparency of the electrooptical substance is controlled by the switching elements.

Light valve device using semiconductive composite substrate

A semiconductor device having a double-side wiring structure, in which a single crystal semiconductor thin film is formed integrally with transistor elements and is laminated on an insulating thin film. The single crystal semiconductor thin film is formed with through-holes and the insulating thin film is formed on its back side with electrodes and a shielding film. A light valve device using the semiconductor device is also disclosed. Over the single crystal semiconductor thin film, there are formed switching elements of transistors, pixel electrodes connected electrically with the switching elements, and drive circuits for scanning and driving the switching elements. Also disclosed is a miniature highly dense light valve device. In this light valve device, an electrooptical substance is arranged between a multi-layer substrate. The multi-layer substrate is formed with electrodes and a shielding film at the opposed side of the insulating film to the side formed with the grouped elements through the insulating film. A transparent opposite substrate is also formed so that the optical transparency of the electrooptical substance is controlled by the switching elements.

A transfer apparatus for transferring a sheet-like medium has a vibrational element or elements which vibrate under control of electrical energy to move the sheet-like medium along a transfer medium. The vibrational element has a tubular hexagonal body with piezoelectric elements on its faces other then the upper and lower face. The lower face is fixed and the upper face has a projection in the shape of a ball which engages the bottom surface of the sheet-like medium during vibration of the vibrational element.

Growing community of inventors

Tokyo, Japan

Hitoshi Niwa