Tomoegawa Paper Co., Inc.

Hitoshi Narushima

Yoshikazu Tsukamoto

Akinori Sei

Tadahiro Oishi

Takashi Shiozawa

Osamu Oka

Atsushi Koshimura

Ken Yoshioka

Tadahiro Ohishi

Yoshio Imai

Toshio Tagami

Masaaki Kakimoto

Osamu Kiyohara

Toshihiro Nakajima

Shouji Aoki

The present invention provides an adhesive film for electronic parts, for example, an adhesive agent in a tape BGA (Ball Grid Array) or &mgr;-BGA (trade name) package, in which embedding and adhesion to copper patterns on circuit boards are excellent, in which feeding and punching quality in the film state are superior, and which can reduce stress caused by thermal expansion difference between a circuit board and a reinforcing metal board or an IC chip. Adhesive film for electronic parts comprises a resin layer in which the dynamic modulus of elasticity at &minus;30 to 125&deg; C. is from 1 to 30 MPa and adhesive layers are coated on surfaces of the resin layer.

Adhesive film for electronic parts

The invention provides an adhesive for electronic parts, which satisfies both points of heat resistance and the ability to form an adhesive layer, and of low-temperature adhesive property, and an adhesive tape for electronic parts making use of such an adhesive. The adhesive comprises, as a resin component, two polyimide resins different in glass transition temperature by at least 20&deg; C. from each other, and an epoxy resin. At least one of the two polyimide resins is a reactive polyimide having structural units represented by the following formula (I) structural units represented by the following formula (II) and structural units represented by the following formula (III), the other is a polyimide having structural units represented by the formula (I) and structural units represented by the formula (II), and the reactive polyimide and the epoxy resin are contained in ranges of at least 25 parts by weight and 10 to 100 parts by weight, respectively, per 100 parts by weight of the whole polyimide resin,

Adhesive for electronic parts and adhesive tape for electronic parts

The invention provides an adhesive for electronic parts, which satisfies both points of heat resistance and the ability to form an adhesive layer, and of low-temperature adhesive property, and an adhesive tape for electronic parts making use of such an adhesive. The adhesive comprises, as a resin component, two polyimide resins different in glass transition temperature by at least 20&deg; C. from each other, and an epoxy resin. At least one of the two polyimide resins is a reactive polyimide having structural units represented by the following formula (I), structural units represented by the following formula (II) and structural units represented by the following formula (III), the other is a polyimide having structural units represented by the formula (I) and structural units represented by the formula (II), and the reactive polyimide and the epoxy resin are contained in ranges of at least 25 parts by weight and 10 to 100 parts by weight, respectively, per 100 parts by weight of the whole polyimide resin,

An adhesive tape for TAB having an organic insulating film, an adhesive layer formed on the organic insulating film and a protection layer formed on the adhesive layer, the adhesive layer being any one of a layer containing a polyamide resin having an amine value of at least 3 and an epoxy resin, a layer containing a polyamide resin and a powdery inorganic filler, a layer containing an epoxy resin having a siloxane structure in its main chain, and a layer containing at least one maleimide compound.

Adhesive tape for tape automated bonding

An adhesive for semiconductor device, comprising (a) a polyamide resin having an amine value of 20 to 60 and a weight average molecular weight of 1,000 to 5,000 and (b) a phenolic compound having a weight average molecular weight of 2,000 or less and having a skeleton containing at least 2 methylol groups.

Adhesive for semiconductor devices and adhesive tape using the adhesive

Adhesive paper for tape automated bonding

Disclosed is a polyamide/polybutadiene/acrylonitrile block copolymer useful in a wide variety of applications, such as an adhesive film, which comprises a polycondensate comprising a polybutadiene/acrylonitrile copolymer having a carboxyl group at each terminal thereof and a polyamide having an aminoaryl group at each terminal, and which is represented by general formula (I) ##STR1## wherein R is a divalent organic group, Ar is a divalent aromatic group, x, y, z, m and n each: represent mean degree of polymerization and are integers in the ranges of x=3 to 7, y=1 to 4, z=5 to 15, n=1 to 30, and nm=2 to 20, respectively. Also, disclosed is a method of producing the polyamide/polybutadiene based block copolymer by polycondensing an aromatic diamine with an aromatic dicarboxylic acid to form a polyamide having an aminoaryl group at each terminal thereof, and then polycondensing it with a poiybutadiene/acrylonitrile copolymer having a carboxyl group at each terminal thereof, preferably in the presence of an aromatic phosphite and a pyridine derivative.

Block copolymer and method of producing the same

This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.

Growing community of inventors

Shizuoka, Japan

Hitoshi Narushima