Tdk Corporation

Mitsubishi Denki Kabushiki Kaisha

Hitoshi Nakayama

Shinichi Araya

Kouji Kudou

Akihiro Katou

Masakazu Toki

Kazuya Abe

Osamu Shindo

Toru Mizuno

Shinji Atsuzawa

Hidetoshi Suzuki

Hiroshi Wakabayashi

Koji Tanaka

Kuniaki Takahashi

Koji Kudo

Yoshihito Hirano

Toshiyuki Ando

Masaaki Kaneko

Akimasa Nakao

Yasuo Yoshida

Youichi Andoh

Yoshihiro Onozeki

Yoshihiko Miyakawa

Masanori Gotoh

Hiroshi Jimbo

Takatoshi Egami

A workpiece mounting apparatus includes a transfer apparatus having a nozzle, a first imaging unit, and an image processor. The nozzle has opposed first and second ends, a suction hole at the first end, and a transparent end face member sealing the second end. The first imaging unit captures a first pattern for positioning a workpiece. The image processor identifies a reference position of the workpiece based on the first pattern captured. The workpiece mounting apparatus also includes a substrate support supporting a substrate with a second pattern for positioning, a second imaging unit for capturing the second pattern, and a positioning unit for controlling position of the nozzle. The image processor identifies a mounting target position on the substrate, based on the second pattern capture, and the positioning unit controls the nozzle to mount the workpiece on the substrate, when the reference position coincides with the mounting target position.

Workpiece mounting apparatus

A workpiece transfer apparatus includes a nozzle unit and an imaging unit. The nozzle unit includes a tubular body, a suction hole opening at one end of the tubular body and an end face member of a transparent body sealing the other end of the tubular body. The imaging unit captures images of first patterns for positioning that are located on an upper surface of a workpiece. The size and shape of the suction hole fits within an outline of the upper surface of the workpiece. The end face member of the transparent body maintains a negative pressure inside the cylindrical body and permits optical penetration for the imaging unit. The imaging unit captures the image of the first pattern for positioning of the workpiece while the imaging unit views a suctioned surface of the workpiece through the transparent body and the suction hole.

Workpiece transfer apparatus

Disclosed is a method, in which when a liquid material is applied to the application surface of an object of application by using a liquid material supply device having a syringe containing the liquid material and equipped with a needle having at its distal end an ejection hole from which the liquid material is ejected, an image of the distal end of the needle is taken laterally by a horizontal camera together with a height reference mark when an ascent/descent drive system of the liquid material supply device is set to a reference height, and the height position of the distal end of the needle is obtained from the difference between the height of the distal end of the needle and the height of the height reference mark.

Method of and apparatus for applying liquid material

An object of the present invention is to provide an element connecting apparatus with which the position of a core of each element in an optical transmission module in a short time with high accuracy. To attain the object, in a core position detection method according to the present invention, upon detecting a core of a PLC chip, parallel light is made incident on the output side end face of the PLC chip, so that the core position is detected based on an image of the input side end face obtained with the parallel light. In addition, the core position is detected by an image of the output side end face that is obtained while parallel light is made incident on the input side end face.

Method and apparatus for connecting optical transmission module and core position detection method for optical waveguide

The present invention relates to an electronic part holding apparatus used for an FPC bonding apparatus or the like. An object of the present invention is to provide the structure including an illumination apparatus used for image detection that can illuminate a predetermined area stably and uniformly. To attain that object, in the holding apparatus having functions of holding and illuminating a work piece, the holding position and the illumination position are made different, and the deformation of the work piece is made possible at the illumination position.

Work piece holding apparatus, work piece illumination apparatus and work piece inspection system

A wind power generation system capable of outputting generated power at high efficiency with a smoothed output power includes a wind power generator and a laser aerovane mounted on the wind power generator or located near the wind power generator. Direction and velocity of wind blowing toward the wind power generator are observed using the laser aerovane, and a yaw angle and/or a pitch angle of the wind power generator is predicted and controlled based on the observation results. Thus, high-efficiency control of the wind power generation system, including the wind power generator, is achieved. An output-smoothing device connected to the wind power generator predicts and controls electric power input/output of the output-smoothing device based on a predicted power output of the wind power generator and smoothes the power output of the wind power generation system.

Wind power generation system

A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip hold on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably held a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

Chip-type circuit element mounting apparatus

A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip held on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably hold a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip held on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably held a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

An automatic electronic component mounting apparatus for automatically mounting electronic components on the printed circuit board includes an electronic component supply mechanism for supplying an electronic component to a predetermined position, at least one mounting head movable in a Y direction, a first controlling mechanism for moving the mounting head in the Y direction, a movable frame movable in an X direction, a second controlling mechanism for moving the movable frame in the X direction and controlling the position of the movable frame in the X direction, a support base supported to the movable frame, and a table carrying a printed circuit board and turnable in a .theta. direction. The table is rotatably supported on the support base so that when the X directional position of the movable frame is controlled by the second controlling mechanism, the X directional position of the table is also controlled. A third controlling mechanism is provided for controlling a .theta. directional position of the table. The mounting head holding an electronic component is fed to the predetermined position by the mechanism to mount the electronic component on the printed circuit board.

Growing community of inventors

Tokyo, Japan

Hitoshi Nakayama