Matsushita Electric Industrial Co., Ltd.

Hitoshi Mukojima

Mitsuru Ozono

Seiichi Sato

Nobuyuki Suefuji

Nobuyuki Iwashita

Takatoshi Ishikawa

Kazuhiko Noda

Osamu Uchida

Akira Nishimura

Yasuhiro Narikiyo

Toshiro Hirakawa

Hiromi Kanaki

An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

Electronic component placement machine having camera units with vertically overlaid apertures

Electronic component placement method

A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.

Paste applicator and paste application method for die bonding

Paste application method for die bonding

In a paste applying method for applying paste in an application area set on the surface of the object to be applied, the application efficiency is enhanced and the application quality is improved by applying the paste in an undulation pattern of convex and concave shape that defines the interior of the surface of the object on which no paste is deposited, where the interior area is substantially enclosed by the undulation pattern of the paste. A discharge port of an application nozzle is moved with one continuous line from an application start point to an application end point along the moving route by a plurality of passing points. The plurality of passing points are set at each comer of the application area and include a plurality of first passing points and a plurality of second passing points, where the first passing points are set at each corner of the application area and the second passing points are set at the central side of the application area.

Paste applying method

Growing community of inventors

Fukuoka, Japan

Hitoshi Mukojima