Kyocera Corporation

Hitoshi Kumatabara

Yasuhide Tami

Yoshitake Terashi

Masahiko Higashi

Shinya Kawai

Noriaki Hamada

Kouichi Yamaguchi

Kenichi Nagae

Masanari Kokubu

Tetsuya Kimura

Michio Shinozaki

Dielectric ceramics comprising a diopside oxide crystal phase, at least one kind of crystal phase selected from the group consisting of a quartz crystal phase and a composite oxide crystal phase containing Ti and Mg or Zn, and a glass phase of an amount of not larger than 30% by weight, said dielectric ceramics having a coefficient of thermal expansion of not smaller than 5.5 ppm/&deg; C. at room temperature to 400&deg; C. and a dielectric loss of not larger than 30&times;10,at 60 to 77 GHz. The ceramics can be obtained by the co-firing with a low-resistance metal such as copper or silver, and can be advantageously used for the production of wiring boards to which the signals of particularly high frequencies are applied. The ceramics has a large coefficient of thermal expansion which can be brought close to the coefficient of thermal expansion of the semiconductor element such as of GaAs or of the printed board. The wiring board produced by using the ceramics effectively prevents breakage in the mounting portion of the wiring board that is caused by a difference in the thermal expansion.

Dielectric ceramics

A structure for mounting a wiring board in which the wiring board including a ceramics insulating board, metallized wiring layers arranged on said insulating board, and a plurality of connection terminals mounted on said insulating board and electrically connected to said metallized wiring layer, is placed on a mother board having wiring conductors formed on the surface of an insulator which contains an organic resin, and the connection terminals of said wiring board are connected by brazing to the wiring conductors of said mother board, wherein a value F1 defined by the following formula (1):

Structure for mounting a wiring board

Growing community of inventors

Kagoshima-ken, Japan

Hitoshi Kumatabara